Latest Posts - Page 2
NAMICS Technology Inc. Announces Mr. Tatsuhiro Fujiki as New CEO
NAMICS Technologies, Inc. has proudly welcomed Mr. Tatsuhiro Fujiki to its esteemed team as the newly appointed Chief Executive Officer....
IFTLE 570: China Restricts Exports of Gallium and Germanium
Beginning August 1, 2023, China has imposed export restrictions on gallium (Ga) and germanium (Ge) products. These restrictions are seen as...
IFTLE 558: Showa Denko becomes Resonac, Joins Japan’s “Joint 2” Consortium
Let’s begin looking at some of the presentations from the 2023 IMAPS Device Packaging Conference in March. Showa Denko becomes...
Interconnect Reliability: From the Chip to the System
Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle...
IFTLE 538: Kyocera Details HDBU and HDI Processing and Looks at US On-shoring
As we noted in IFTLE 537, prior to the 2022 IMAPS conference in Boston earlier this month, IMAPS hosted a...
Cross-disciplinary Experience is Key to Intern Success
As a graduate student in computer science, I was excited to learn about a machine learning internship at Brewer Science....
Materials Science Solutions for Electronics Sustainability
This summer, the temperature reached 111°F in Silicon Valley, where I live. This historical record unmistakably brought home the “inconvenient...
Sustainability 101: Are Your Products Toxic?
Do you know how many individual elements and chemical compounds are required to make a circuit board? I don’t. There...
Development of Innovative Advanced Packaging Materials for System in Package
Advanced packaging has continued to evolve with various interconnect technologies on their way towards heterogeneous integration. Different assembly processes are...
Maximizing Protection of Flip Chip Interconnects with NCP and NCF
NCP and NCF Property Optimization Delivers High-Reliability Results Semiconductor package sizes are getting smaller and bump pitches narrower while the...
IFTLE 497: Ajinomoto Expands Materials Offerings; BESI readies for Chiplet Era
Continuing our look at presentations from the IMAPS SiP Conference. Ajinomoto Habib Hichri of Ajinomoto discussed the use of novel...
IFTLE 479: ABF Substrate Shortages; Consolidation Continues
This past fall, our packaging industry saw significant shortages of packaging substrates made from Ajinomoto Build-up Film (ABF). Let’s take...
IFTLE 467: More Highlights of IMAPS 2020
Avi Bar Cohen 1946 – 2020 Before we take a look at some interesting papers from the recent IMAPS 2020...
Get your copy of LAYERS – Thin-film Technology News in Advanced Packaging
LAYERS 5, from Evatec, is your guide to all the latest thin-film technology news across advanced packaging, semiconductor, 0ptoelectronics, and...
Temporary Bonding and Mold Process to Enable Next-Gen FOWLP
Temporary wafer bonding processes were initially developed for enabling three-dimensional (3D) stacked integrated circuits (ICs). For example, dies can be...
Social Distancing Spotlight: NAMICS
Brian Schmalz, NAMICS, Talks About the Future of Electronics Materials Since we launched the program in January, the 3D InCites...
NAMICS Receives Intel’s Preferred Quality Supplier Award
NAMICS Corporation has been recognized by Intel as a recipient of a 2019 Preferred Quality Supplier (PQS) Award. The PQS...
IFTLE 438: Reliability Test For 0.3mm WLCSP; Copper RDL Trace Requirements
This week we continue our look presentations from SEMICON Europa’s Advanced Packaging Conference. Intel’s Reliability Test Beth Keser’s group at...
