Indium Corporation, a global leader in materials science and electronics assembly solutions, commemorated its 90th anniversary on March 13. Indium...
San Jose, CA – February 21, 2024 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials...
NAMICS Technologies, Inc. has proudly welcomed Mr. Tatsuhiro Fujiki to its esteemed team as the newly appointed Chief Executive Officer....
Beginning August 1, 2023, China has imposed export restrictions on gallium (Ga) and germanium (Ge) products. These restrictions are seen as...
Let’s begin looking at some of the presentations from the 2023 IMAPS Device Packaging Conference in March. Showa Denko becomes...
Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle...
As we noted in IFTLE 537, prior to the 2022 IMAPS conference in Boston earlier this month, IMAPS hosted a...
As a graduate student in computer science, I was excited to learn about a machine learning internship at Brewer Science....
This summer, the temperature reached 111°F in Silicon Valley, where I live. This historical record unmistakably brought home the “inconvenient...
Do you know how many individual elements and chemical compounds are required to make a circuit board? I don’t. There...
Advanced packaging has continued to evolve with various interconnect technologies on their way towards heterogeneous integration. Different assembly processes are...
NCP and NCF Property Optimization Delivers High-Reliability Results Semiconductor package sizes are getting smaller and bump pitches narrower while the...
Continuing our look at presentations from the IMAPS SiP Conference. Ajinomoto Habib Hichri of Ajinomoto discussed the use of novel...
This past fall, our packaging industry saw significant shortages of packaging substrates made from Ajinomoto Build-up Film (ABF). Let’s take...
Avi Bar Cohen 1946 – 2020 Before we take a look at some interesting papers from the recent IMAPS 2020...
LAYERS 5, from Evatec, is your guide to all the latest thin-film technology news across advanced packaging, semiconductor, 0ptoelectronics, and...
Temporary wafer bonding processes were initially developed for enabling three-dimensional (3D) stacked integrated circuits (ICs). For example, dies can be...
Brian Schmalz, NAMICS, Talks About the Future of Electronics Materials Since we launched the program in January, the 3D InCites...
NAMICS Corporation has been recognized by Intel as a recipient of a 2019 Preferred Quality Supplier (PQS) Award. The PQS...
This week we continue our look presentations from SEMICON Europa’s Advanced Packaging Conference. Intel’s Reliability Test Beth Keser’s group at...