advanced packaging materials

Heterogeneous Integration Calls for Increased Materials Reliability

Heterogeneous Integration Calls for Increased Materials Reliability

Automotive reliability is a pivotal concern for heterogeneous integration technologies, especially as emerging mission profiles for electric and autonomous vehicles push component lifetimes out by two to three times or more over standard testing regimes. There has been an increasing realization of the importance of chip-package interaction (CPI) as a source of reliability issues in semiconductor a... »

IFTLE 402: Advanced Packaging Underfills; JEDEC Updates HBM Memory Standard; Intel Foundry Business

IFTLE 402: Advanced Packaging Underfills; JEDEC Updates HBM Memory Standard; Intel Foundry Business

Continuing our look at presentations from the recent 2018 IWLPC conference, let’s look at the Jiw Pai Henkel presentation on advanced packaging underfills. Henkel – Underfill Options for Advanced Packaging Bai and co-workers examined the use of capillary underfill (CUF), non-conductive paste (NCP)  and non-conductive film (NCF) in advanced packaging applications (Figures 1 and 2). Each of... »

Polymeric Materials: Massive Adoption by the Advanced Packaging Industry

Polymeric Materials: Massive Adoption by the Advanced Packaging Industry

According to the market research and strategy consulting company, Yole Développement (Yole), the polymeric materials market revenue will double over the next five years. Driven by movements towards further miniaturization and higher functionalities, megatrend applications like artificial intelligence (AI), 5G, and augmented/virtual reality (AR/VR) are creating huge business opportunities. Therefo... »

Advanced Packaging and 3D come to MRS Spring Meeting

Advanced Packaging and 3D come to MRS Spring Meeting

For the first time ever, the Materials Research Society (MRS) brought its annual Spring meeting to Phoenix. I have never attended this event, as it is deeply academic, and has not been on my radar for 3D or advanced packaging technologies. However, after finding out from fellow SemiSisters, Rozalia Beica, Yole Developpement, and Nancy Stoffel, GE Global Reseach, that there was an advanced packagin... »

Shifting Packaging Landscape brings Both Challenges and Growth

Shifting Packaging Landscape brings Both Challenges and Growth

2015 overall was a mixed year for the materials sector in the electronics market, with a general slowdown in PC-related segments offset by continued growth in mobile smart phones and other handheld devices despite industry growth flattening out late in 2015. In 2016, market forecasts indicate some improved growth and potential technology shifts. Looking at the 3D IC packaging market specifically, ... »