Ashley Kuppersmith

About Ashley

Ashley Kuppersmith is Product Manager, Wafer Level Packaging at MacDermid Alpha Electronics Solutions. She joined the company in 2017 as a Research Chemist, focused on copper plating processes for wafer level packaging applications. Since transitioning to product management in 2022, she has been driving innovation in advanced materials, including the development of the new Low Alpha Tin portfolio, supporting the semiconductor industry's push toward higher performance and reliability.