Latest Posts - Page 2
Europe in 3D: The 2014 Winter Tour
This winter, I’ve been invited to moderate panels at two 3D industry events. The first will be at the European...
Improving Yield and Reducing Cost of 3D TSVs: Outlook for 2014
At Alchimer, we believe that as it becomes technically more difficult to shrink to further nodes, companies will turn to...
Catching up with Sand 9 at the MEMS Executive Congress 2013
Sometimes 3D IC/TSV news comes in with a splash on the front page of the morning paper, maybe somewhere above...
Polymer Filled TSVs: Solving the Cu Stress Issue
I’ve been on a quest to find out more about EV Group’s new polymer filled TSVs since they first announced...
Dow Introduces SOLDERON Tin-Silver Plating Chemistry for Lead-Free Bumping
The company’s next-generation SnAg offers industry-leading plating rates and process flexibility for flip chip packages and interconnects. Dow Electronic Materials...
Shaping the Future of MEMS, Sensors, and 3D IC: Fertile Grounds for Collaboration
STMicroelectronics brought a “Who’s Who” of thought leaders from across the MEMS and Sensors ecosystem to Santa Clara, CA, on... Rudolph Announces New Metrology Suite for Advanced Packaging
New NSX Metrology Series includes application-specific configurations to address unique metrology requirements for wafer level packaging, 2.5D and 3DIC Rudolph...
Bumps are the Elephant in the Wafer Stress Room: NCCAVS Joint User Group Meeting On 3D Packaging
The Northern California Chapter of the America Vacuum Society has, for years, run a very strong program of ongoing User...
FormFactor: NanoPierce Contactor
Product Description FormFactor’s NanoPierce™ contactor is a socket solution for direct testing of TSVs and micro-bump arrays for 3D IC...
A Word about Cleans for 3D ICs
While interviewing SSEC on its TSV clean and TSV reveal processes, and Dow Corning on its temporary bond/debond process, the...
ASMC 2013 and 3D IC: Time to Volume, Time to Via
What is today’s biggest threat to continued growth in the semiconductor industry? Subramani Kengeri, Vice President, Advanced Technology Architecture, GLOBALFOUNDRIES,... SPTS Ships 1000th DRIE Process Module
Milestone shipment extends company’s leadership in DRIE Newport, United Kingdom, and SEMICON Singapore, 7 May, 2013 – SPTS Technologies, a supplier...
ECTC 2013: 2.5D and 3D IC Technology Preview
One thing is for sure, from special sessions to the standard technology tracks, there is no shortage of 3D-focused events...
European 3D TSV Summit: But Wait, There’s More!
Day Two of the European 3D TSV Summit dawned bright and clear, with such a spectacular view of the nearby...
Proof that the Collaboration Model Works for 3D ICS
For the past year or so at various conferences, symposiums and summits focused on 2.5D and 3DIC technologies; we’ve been... European 3D TSV Summit: Focus on Cost of Ownership
Now that the “technology bricks” for building 2.5D devices and 3D ICs have been essentially qualified, the focus has turned... European 3D TSV Summit: 3D TSVs Come of Age
Here I am, on my way back from Minatec Campus in Grenoble, France, where I attended SEMI Europe’s premiere European...
Temporary Bond/Debond: Not Ready for 3D TSV Prime TIme
It’s too bad SUSS MicroTec’s Wilfried Bair was one of the last presenters on Friday at 3D Architecures for Systems...
