IFTLE 407: Intel Lakefield Uses 3D Stacking; SEMI Europe’s 3D & System SummitMar 22, 2019 · By Phil Garrou · Packaging IFTLE At CES 2019, Intel previewed a new client platform, code-named “Lakefield”. It featured the first iteration of its new innovative...
Fraunhofer EMFT: Our Early and Ongoing Work in 3D IntegrationJan 22, 2016 · By Peter Ramm · Resource Library Fraunhofer has been working on 3D integration for the past three decades, starting in1987 with a consortium of Siemens, AEG, Philips...
Developing 3D Systems with Ultrafine and Dense InterconnectionsJan 04, 2016 · By Eric Beyne · Blogs For the past 2 to 3 years, 3D integration technology has developed into a technically and economically interesting road for further...
Europe in 3D: The Brains behind e-BRAINSJan 16, 2014 · By Francoise von Trapp · Blogs After so many years covering 3D technologies, I love finding a new angle to write about. Yesterday’s visit to Fraunhofer...
Building the 3D Central Nervous SystemOct 05, 2010 · By Francoise von Trapp · Blogs As human beings, we take a lot of things for granted; breathing, for example, or our heart beating when it...