Matches for your search: "hybrid bonding "
Despite the fact that monolithic 3D IC is still very much in development stages, its promise to gain a full node in terms of power and performance while eliminating the need for TSVs, gained it “Hot Topic” status at this year’s Design and Test Europe (DATE 2015) which took place...
When 3D integration has been discussed in the past, whether in terms of a true 3D IC stack or an interposer-based design, the cost of 3D ICs has not always been part of the discussion. In the past couple of years, as 3D ICs have moved closer to reality, more attention...
I don’t usually write about MEMS. But every once in a while, when MEMS (stands for micro-electromechanical systems) touches anything to do with 3D integration, usually at the system-level, I might veer slightly out of my comfort zone to interview a MEMS supplier about their latest developments. I find it’s...
Last week, HotChips 2014 (aka HC26) was held at the Flint Center within the De Anza College in Cupertino, California. As in many previous years, I attended both the Sunday tutorial and the main conference on Monday and Tuesday. As usual, there were great keynotes and lots of interesting technology news. The tutorial always focuses...
CIRCL CV310i module is an advanced Wafer Edge inspection, metrology and profiling system tailored for Advanced Wafer Level Packaging. Simultaneous wafer edge inspection and metrology enables comprehensive data collection from all zones comprising the wafer’s edge: top and bottom near-edge; top and bottom bevel; and apex. Testimonial Some of the...
While GLOBALFOUNDRIES and STATS ChipPAC may have it all figured out, there are many who still consider temporary bond/debond (TB/DB) to be an unsolvable challenge that adds unnecessary cost. The solution? Find a way to do away with it altogether. During the 3D IC Forum at SEMICON Singapore, both A*STAR...
Ladies and Gentlemen of the semiconductor industry, we have a new acronym to add to 3D integration lexicon and its name is 3D SoC (aka: 3D system on a chip, or 3D system partitioning, or mixed node integration – take your pick). Whatever the moniker, it looks like THIS is...
Ziptronix Inc., provider of patented, low-temperature direct bonding technology for 3D integration, announced an agreement with Tezzaron Semiconductor Corporation and Novati Technologies, a wholly owned subsidiary of Tezzaron, as a next step toward the acceleration of 3D integration. As a key part of the agreement, Ziptronix sold its 3D IC...
What can we expect out of 2.5 and 3D TSV Integration? What are the three leading-edge R&D institutes in 2.5 and 3D TSV investigating? On November 18, SEMI offered a webinar entitled “3D TSV without Limits.” Francoise von Trapp of 3D InCites moderated the webinar which featured Eric Beyne, director...
The IEEE 3D Systems Integration Conference (IEEE 3D IC) is a unique event that is a truly international effort in assembling all those involved in research and commercialization of 3D IC and 3D systems from around the world. Location for the event rotates annually from Munich to Tokyo to San Francisco. This...
