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This year’s European 3D Summit in Dresden, which highlighted “Heterogeneous Integration Driving 3D”, was led off by presentations and a lab tour of the Fraunhofer Institute, whose 18 high-performance centers collaborate with companies, universities and other research institutes in Germany. All pictures and diagrams courtesy of Fraunhofer IZM. The Fraunhofer...
Françoise promised in her recent blog that my ECTC blog would follow shortly. Finally, after attending DAC in Austin as well as the iMAPS’ SiP Conference in California’s Wine Country and shortly before attending Semicon West in San Francisco, I found some time to report what I saw and learned...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that, for the fifth successive year, it has earned all three awards resulting from VLSIresearch’s annual Customer Satisfaction Survey. For 2017, EVG was ranked as one of the 10...
North Billerica, MA, USA, March 20, 2017 — MRSI Systems, a leading provider of fully automated, high-speed, high-precision die bonding and epoxy dispensing systems, today announces the installation of its flagship MRSI-M3 Die Bonder in AIM Photonics Academy’s Education and Practice Factory at the Massachusetts Institute of Technology (MIT) in...
Tezzaron’s multi-project wafer program: participant perspectivesTo follow up with last week’s report on Tezzaron’s multi=project wafer program (MPW), I asked a few of the participants to share information about their part in the project, and the benefits of working in this paradigm. The first respondent was Donald Chiarulli, Professor...
It wasn’t on the final agenda, but thanks to a last-minute presentation switch by BiTS Workshop keynoter Jim Feldhan, president of Phoenix-based Semico Research, 3D became a featured topic at this year’s event. For the past few years, BiTS General Chair, Fred Taber, has contracted me to conduct video interviews...
While there’s no denying that our registered members, guest bloggers, forum panelists, advisory board, and regular readers are all vital elements of the 3D InCites community, none of this would be possible without the financial input of our advertisers. So I would like to briefly take up some blog space...
My head is spinning. I just spent a few hours reading through all the latest 3D technology posts on various semiconductor news websites; something I find myself doing a lot more ever since I took on 3D-ICs.com. As editorial director of that site, it’s my job to sift through all...
Things have been pretty crazy lately, what with wearing several hats and all. I spent two days in Silicon Valley last week visiting some companies on behalf of Chip Scale Review, and also at SEMI for an Advanced Packaging Committee meeting for SEMICON West to hammer out the 3D program. ...
I’ve been talking a lot about the collaborative efforts in the form of open and closed consortia and joint development agreements that seem to be carrying 3D IC integration forward to market adoption. Another approach is a multi-project wafer program, in which participants cost-share to build multiple device prototypes...
