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As the industry pushes toward ever-greater levels of semiconductor performance, integration and efficiency, the promise of 3D integrated circuits (3D ICs) stands out as a true game-changer. By stacking dies and embracing heterogeneous integration, 3D ICs make it possible to create compact, power-efficient systems far beyond what can be achieved...
The ASYMTEK Vantage® Dispensing system equipped with IntelliJet® Jetting system reduced underfill voids and decreased cycle time by almost 30% Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology,...
YES, a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and AR/VR applications, today announced that its TersOnus TGV tool was released for panel-level manufacturing. This system will be used to support the growth of advanced heterogeneous packaging for artificial intelligence chips that enable large language models....
Keeping pace with Moore’s law continues to be challenging and is driving the adoption of innovative packaging technologies that support continued system scaling while doing so at lower costs than comparable monolithic devices. These packaging technologies disaggregate what would typically be a homogenous, monolithic device — like an ASIC or...
BEAVERTON, Ore.–(BUSINESS WIRE)–Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company today announced the formation of an industry consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem. The organization, representing a diverse...
EVG S&R Mastering Shop™ further lowers barriers to adoption of nanoimprint lithography for wafer-level and panel-level production applications such as optical sensors, micro-lenses, nanophotonics and silicon photonics EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it...
Automotive electronics, with the Holy Grail being fully autonomous vehicles, is currently being touted as one of the biggest growth drivers for the semiconductor industry. So much so, that every event I’ve attended so far this year has featured sessions, presentations, keynotes, and panel discussions espousing the benefits of autonomous...
“We are at a crossroads. Current chip design is nearing its capacity. The time, expense, and effort needed to make major inroads have grown exponentially. We need a transformational shift in how our systems are designed and put together. Moore’s law is no longer about scaling a chip, but about...
Dear Chip and System-level Designers, Allow me to introduce myself. My name is Françoise von Trapp, and I am known in the semiconductor industry as “The Queen of 3D”. This is because I have held a deep interest in 3D integration technologies, and have devoted the past 7+ years to...
With two 3D focused keynotes and a 3D panel discussion, 3D Thursday was ripe for the tweeting. The sound bites were coming fast and furious from Subu Iyer, IBM Fellow, and Rao Tummala, director of Georgia Tech’s 3D Packaging Research Center. Additionally, the 3D Panel featuring both Iyer and Tummala,...
