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Visit Booth #B1465 at SEMICON Europa to explore PFAS-free, high-performance materials enabling next-gen AI packaging Brewer Science, Inc., a global leader in developing and manufacturing innovative materials for micro- and optoelectronics, will exhibit its latest advancements in sustainable lithography processes at SEMICON Europa 2025. Attendees are invited to visit Brewer...
We presume all are excited about the upcoming SEMICON West show. I know we sure are! Be sure to stop by the 3D InCites booth #731 and say hi or if you are walking by the SEMI booth Francoise may be in action recording a Podcast, acting as the official...
Minneapolis, Minnesota— November 18th, 2020 — CyberOptics® Corporation a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will present at the Virtual IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE) on December 16th at 8:00amCT. Tim Skunes, VP of R&D at CyberOptics, will share the technical presentation...
Nimes, France, April 15, 2016 – FOGALE Nanotech today announced that it has acquired Altatech, a specialized technology leader in the development of wafer inspection and material deposition tools for semiconductor manufacturing. Altatech SAS has headquarters in Grenoble, France, located in the center of the French Silicon Valley with a...
Through silicon via (TSV) technology is a key design element being incorporated into more and more advanced packaging designs today. TSVs offer distinct benefits in form factor and improved performance and can enable new, innovative designs not previously possible. To scale this valuable technology and spark industry adoption, there is...
Flanders, New Jersey (April 1, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced that a major semiconductor foundry and a top outsourced semiconductor assembly and test (OSAT) facility have placed multi-million dollar orders totaling approximately $17M for several NSX® Series and Wafer Scanner™ inspection systems. Several systems were shipped in the first quarter...
To enable high-volume production readiness of 3D-based products, SEMATECH’s 3D Interconnect and Manufacturability programs will be conducting Equipment Maturity Assessments (EMAs) of several critical 3D tools during 2012 to establish functional equipment capabilities and address high volume manufacturing maturity issues. The assessment is a cooperative effort among experts from SEMATECH’s...
The official inauguration of STATS ChipPAC’s 300mm eWLB facility was held September 15, at the company's Yishun facility in Singapore with more than 150 local dignitaries, customer representatives, business partners and management participating. In April of 2010, STATS ChipPAC established itself as the first in the world to implement 300mm...
New System Provides World-class Alignment Technology at an Affordable Cost
At MIT Lincoln Labs (MITLL), R&D processes developing 3D chips using silicon-on-insulator (SOI) wafers is the sole focus. As Phil Garrou, Ph.D.
