Matches for your search: "fan-out wafer level packaging "
ACM’s patent-pending nitrogen bubbling technique provides significant wet etching uniformity improvement and enhanced cleaning performance ACM Research, Inc., a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications, announced major upgrades to its Ultra C wb cleaning tool. These new enhancements are designed to meet the...
Latest Generation Front-end Cleaning Tool Reduces Chemical Use by 75% ACM Research, Inc., a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced a major performance breakthrough for its flagship Ultra C Tahoe Cleaning tool. The resulting enhancements are designed to meet demanding technical...
A recent report by Semi Analysis (SA) notes that Intel has backed off on the use of chiplets in its 5th Generation Xeon Scalable Processor Emerald Rapids (EMR). SA reports that at a recent Intel webinar, VP Sandra Rivera revealed that EMR, Intel’s 5th Generation Xeon Scalable Processor, had backtracked...
New Portfolio Leapfrogs the Competition with Innovative Etch Techniques and Chemistries to Support Development of Advanced Logic and Memory Solutions FREMONT, Calif., Feb. 09, 2022 (GLOBE NEWSWIRE) — Lam Research Corp. (NASDAQ: LRCX) today announced a new suite of selective etch products that apply breakthrough wafer fabrication techniques and novel...
Move to 300mm Strengthens Customer’s Position in the Rapidly Growing CMOS Image Sensor Market Newport, United Kingdom, 29 May, 2014 – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced that a leading Chinese wafer level packaging (WLP) supplier to...
The IEEE 3D Systems Integration Conference (IEEE 3D IC) is a unique event that is a truly international effort in assembling all those involved in research and commercialization of 3D IC and 3D systems from around the world. Location for the event rotates annually from Munich to Tokyo to San Francisco. This...
It’s hard to believe that inside such a non-descript building set back down a picturesque country lane in (almost) rural Indiana, really cool things are happening. This is the home of Dynaloy, LLC, a subsidiary of Eastman Chemical Company, where innovative chemical formulations are being developed to remove the most...
What is today’s biggest threat to continued growth in the semiconductor industry? Subramani Kengeri, Vice President, Advanced Technology Architecture, GLOBALFOUNDRIES, opening the 24th annual SEMI Advanced Semiconductor Manufacturing Conference in Saratoga Springs, NY, asked just that question in his keynote address. (Asked it twice, actually; once at the beginning of...
Now that the “technology bricks” for building 2.5D devices and 3D ICs have been essentially qualified, the focus has turned to optimizing them for improved cost of ownership (CoO). At last week’s European 3D TSV Summit, in Grenoble, France, many of the supplier presentations demonstrated how their companies have been...
For me, the most exciting news so far at this year’s 3D ASIP conference has been the announcement that Tezzaron Semiconductor is licensing both Ziptronix’s Zibond and DBI technologies . Really, I did backflips when I read the press release, because I have a soft spot for technology innovators and...
