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Copper Dual Damascene for Wafer-Level Packaging: Enabling Reliable, High-Density Interconnects

Aug 25, 2025

Overcoming yield loss, reliability risks, and scaling limits in advanced packaging with high-aspect-ratio copper interconnects. As device architectures shrink, delivering high-reliability, fine-feature interconnects without sacrificing yield or performance has become a critical challenge for semiconductor manufacturers. In fan-out-wafer-level-packaging (FOWLP), chiplet-based designs, and high-density 2.5D/3D integration, the need for compact, high-performance...

Asia May Still Be the Hottest Spot for Advanced Packaging

Jan 27, 2025

When the United States and Europe looked to re-shore semiconductor technology, the primary focus was restoring leading-edge manufacturing and creating more resilient supply chains throughout the ecosystem. Eventually, it emerged that nearly all of the leading-edge advanced packaging took place in Asia, and there was minimal packaging capability in either...

fan-out panel level packaging

ACM Research Enters Fan-out Panel Level Packaging Market with Introduction of Ultra C vac-p Flux Cleaning Tool

Jul 29, 2024

Utilizes vacuum technology and IPA drying to enhance cleaning efficiency for cost-effective fan-out panel-level packaging ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced the Ultra C vac-p flux cleaning tool for fan-out panel-level packaging (FOPLP). Utilizing...

SEMICON Europa 2023 Community Member Preview

Nov 08, 2023

SEMICON Europa 2023, co-located with productronica in Munich, Germany makes for one of the strongest single events for electronics manufacturing in Europe. Together, SEMICON Europa and productronica showcase the entire spectrum of technologies and solutions for the entire semiconductor and electronics manufacturing industries, reflecting the rapid pace of technological development...

IFTLE 572: North American Advanced Packaging, New Materials, and New Leaders

Oct 18, 2023

This week, we finish our look at papers presented during the IMAPS CHIPCon Conference held in July, 2023, where we focus on North American advanced packaging and new ABF materials. We also applaud the appointment of Dr. Suby Iyer to head up NAPMP, and Dev Palmer’s promotion from within DARPA....

Advanced Packaging is Everyone’s Business!

Dec 13, 2019

“Changes in the semiconductor supply chain and shifting business models, as well as uncertainty related to US-china trade, creates a growing number of huge opportunities for some while posing a threat to others,” comments Emilie Jolivet, Division Director, Semiconductor & Software at Yole Développement (Yole). “At Yole, we are continuously...

IFTLE 425: Deca FOWLP is Going Mainstream; Highlights from Hot Chips

Sep 12, 2019

Deca Technologies has confirmed that its M-Series™ fan-out wafer-level packaging (FOWLP) technology has been adopted by Qualcomm for power management integrated circuit (PMIC) devices in Samsung’s S10, the Xiaomi Mi 9 and LG G8 smartphones. (Figure 1). And in other news, advanced packaging was the Cinderella Story at Hot Chips...

IFTLE 401: FOWLP for RF; D2W Hybrid Bonding; FOPLP in Samsung Watch

Jan 03, 2019

As its name implies, the International Wafer Level Packaging Conference (IWLPC) initially covered wafer-level packaging (WLP) technologies. As all conferences do, it soon expanded its scope to cover basically all advanced packaging topics including WLP, fan-out wafer-level packaging (FOWLP), 2.5D/3D, and advanced manufacturing and test, etc. Statistics from this year’s...