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EV Group Hybrid Bonding, Maskless Lithography and Layer Transfer Solutions for Heterogeneous Integration to be Highlighted at ECTC 2025

May 14, 2025

ST. FLORIAN, Austria, May 14, 2025—EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today announced that new developments in heterogeneous integration enabled by its wafer-to-wafer and die-to-wafer hybrid bonding, maskless lithography, metrology and infrared (IR) laser...

Onshoring Advanced Packaging Update

Apr 08, 2025

Rarely a week goes by without Jensen Huang, the CEO of Nvidia, being in the news. In late March, during Nvidia’s GTC developers conference, Huang was in the news daily as he updated the world on how Nvidia was addressing hardware and software needs for AI, as well as starting...

Fraunhofer IZM-ASSID “The White House of Microelectronics Packaging”

The “White House of Microelectronics Packaging” Celebrates Its 15th Anniversary!

Feb 10, 2025

By Juliana Panchenko and Frank Windrich, Fraunhofer IZM-ASSID 15 years ago, Fraunhofer established the “White House of microelectronics packaging”— a leading-edge research center for 3D integration and advanced wafer-level packaging on 200/300mm wafer sizes. It was founded based on visionary ideas in the field of microelectronic packaging from the former...

SEMICON West 2023 Member Preview

Jul 05, 2023

SEMICON West 2023 is taking aim at Building a Path Forward with a reimagined exhibition and conference as industry experts and visionaries gather July 11-13 at the Moscone Center in San Francisco. The event focuses on key challenges affecting the global microelectronics industry which include Supply Chain Disruptions, Climate Change, and Talent...

Global Semiconductor Packaging Materials Market to Near $30 Billion by 2027

May 23, 2023

SEMI, TECHCET and TechSearch International Highlight Diverse Growth Drivers in New Report MILPITAS, Calif. – May 23, 2023 – Powered by strong demand for new electronics innovations, the global semiconductor packaging materials market is expected to reach US$29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the...

ACM Research Launches Stress-Free Polishing Tool for Advanced Packaging Applications; Delivers First Tool to Leading Chinese OSAT

Mar 19, 2020

Ultra SFP ap Provides Environmentally Friendlier Alternative to Conventional CMP for TSV and Fan-Out Wafer-Level Packaging Processes Fremont, California – March 18, 2020 – ACM Research, Inc. (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today introduced the Ultra SFP ap tool...

A Look Inside The 3D Technology Toolbox For STCO

Aug 09, 2019

System-technology co-optimization (STCO) – enabled by 3D integration technologies – is seen as a next ‘knob’ for continuing the scaling path. In this article, we will unravel the STCO principle, open up the 3D technology toolbox and bring up two promising cases: logic on memory, and backside power delivery. After DTCO...

IFTLE 404: One Micron RDL; FOWLP Die Shift; Antennas for FOWLP

Feb 14, 2019

In this IFTLE post, we continue our look at presentations from the 2018 EPTC Conference… Ultratech / IMEC / JSR – 1µm RDL Ultratech, IMEC and JSR discussed “One Micron Damascene Redistribution for Fan-Out Wafer Level Packaging using a Photosensitive Dielectric Material”. This study compared the creation of 1.0μm RDL...

Advanced Packaging Industry: What’s New on the Market?

Jan 13, 2016

The mobile sector is driving production and market growth; however a new market driver, the Internet of Things (IoT) is on the horizon and is expected to have a significant impact on the advanced packaging industry. “IoT-driven semiconductor industry consolidation is reflecting into a highly dynamic advanced packaging landscape,” says Andrej Ivankovic,...

System Plus Consulting reveals the Samsung Galaxy S6 hidden technologies

Nov 20, 2015

The mobile phone industry has grown to produce more than 1.1 billion devices in 2014 (Source: Camera Module Industry report, Yole Développement, Aug. 2015). With every new model, smartphone manufacturers are trying to bring users a better experience, incredible functions, innovative design and new applications. But how are they manufacturing...