Matches for your search: "fan-out wafer level packaging "
Artificial intelligence (AI) is driving the need for faster processing speeds to keep up with the large language models. As a result, we see multi-reticle packages using 2 x 800 mm2 chips in production in a single package. These larger chip sizes and the need for better yields and higher...
SEMICON Taiwan is arguably the most influential semiconductor event in Taiwan, reaching records high in terms of scale in its 27 years of history, attracting 700 exhibitors, using a total of 2,450 booths, and organizing more than 20 international forums. This year it will spotlight eight key industry themes: advanced...
One of the most popular booths at the recent IMAPS DPC was that of wafer-level fan-out technology provider, Deca. Their black tee shirts state “SHIFT HAPPENS” on the front and on the back say, “We clean it up” (referring to their adaptive patterning of course). Also of great interest was...
Adoption of advanced packaging is accelerating as the benefit of the classic Moore’s Law transistor shrink diminishes on a monolithic die. Advanced packages enable the heterogenous integrations of multiple different die through high-density interconnects, for improved device performance and smaller footprint. Advanced packaging architectures like Intel’s Embedded Multi-Die Interconnect Bridge,...
SEMICON China attracts the world’s leading technology companies who design, develop, manufacture, and supply the technologies to manufacture the microelectronics that drive today’s most sophisticated consumer and commercial electronic products. Many of our 3D InCites community members are exhibiting and/or presenting during the show. Here is a preview of what...
These days, the first thing that comes to mind when someone mentions fan-out (FO) technology is Apple’s A10 processor built on TSMCs integrated fan-out (InFO) technology. It’s the superstar application that put FO on the map and into high volume manufacturing. However, equally important to remember are the numerous low-density...
Long gone are the days of the “killer app” and the notion that a single device market like personal computers (PCs) or smartphones alone can make or break the semiconductor industry. In fact, while both those markets have softened, a multitude of emerging technologies including 5G, artificial intelligence (AI), internet...
As the two-dimensional (2D) shrinking of planar circuits (on which Gordon Moore based his famous observation) has become more difficult and expensive, the semiconductor industry has had to find other ways to continue to put more computing power and speed into less volume. At the same time, consumers are demanding...
KLA-Tencor Corporation (NASDAQ: KLAC) announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP™ and ICOS® T830. Designed for characterization and monitoring of the diverse processes used in wafer-level packaging, CIRCL-AP enables all-surface wafer defect inspection, review and metrology at high throughput. The ICOS T830 provides fully automated optical...
Moore’s law is approaching physical limitations of CMOS scaling, and three dimensional (3D) integration technologies have been proposed as solutions. Wide band transmission between logic and memory is becoming indispensable for not only mobile products, but also other products related to network systems such as servers and data centers. These...
