Matches for your search: "fan-out wafer level packaging "
The 72nd IEEE Electronic Components and Technology Conference (ECTC) was held again in person from May 31st to June 3rd, 2022. The conference brought together more than 1,500 industry professionals, academics, and students from 23 countries after three virtual years. A Big Thank You to our ECTC family for this...
One of the hottest trends in semiconductor manufacturing today is wafer-level packaging (WLP). According to Allied Market Research, the global WLP market size is expected to reach $7.8 billion by 2022, registering a compound annual growth rate (CAGR) of 21.5% from 2016 to 2022. Broadly defined, WLP encompasses different integration...
Veeco’s WaferStorm® Platform and AP300™ Lithography System Deliver Premier Process Performance, Platform Flexibility and Low Cost of Ownership PLAINVIEW, New York, — Veeco Instruments Inc. (Nasdaq: VECO) announced today that Unisem Advanced Technologies Sdn Bhd (UAT) has purchased Veeco’s WaferStorm® single wafer solvent wet process tool and its AP300™ lithography...
The recipient of the 2019 3D InCites Award for Process of the Year was Belgian research institute, imec, for its two-step wafer-level transfer mold process for 3D die-to-wafer assembly. The individual who nominated them for the award didn’t provide any more detail than that. But luckily at ECTC 2019, when...
One topic that has been under hot debate in the semiconductor advanced packaging sector for the past few years is fan-out panel-level packaging (FOPLP). In theory, the concept of taking fan-out from a 300-mm reconstituted wafer to a large panel format as a way to lower costs seems simple, and...
2016 will be remembered as the year fan-out wafer level packaging (FOWLP) went mainstream, thanks to TSMC’s strategic move in the advanced packaging arena and especially its integrated fan-out (InFO) win inside the iPhone 7. Already in high-volume manufacturing (HVM), FOWLP volumes significantly increased in magnitude. Will this strong momentum...
SAN JOSE, Calif.,- Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX and Deca Technologies, a subsidiary of Cypress Semiconductor Corp. (NASDAQ: CY), today announced the signing of an agreement whereby ASE will invest $60 million in Deca and will license Deca’s M-Series™ Fan-out Wafer-Level Packaging (FOWLP) technologies and processes. As...
Did anyone miss the Sound of Music bit during the Oscars? Anyway, with the sounds of “The Hills are alive..” in my head, I drove off the next day down to the Hill Country in Austin to the invitation-only, On The Road to Fine Feature IC Package Substrates and Interposers...
Follow-on Order Demonstrates the Strength of EVG’s High-volume Manufacturing Solutions for Wafer-level Camera Applications
Dr. Phil Garrou, Microelectronic Consultants of NC, USA Dr. Phil Garrou is a subject matter expert for DARPA and runs his consulting company Microelectronic Consultants of NC in the RTP NC area. He retired from Dow Chemical in 2004 as Global Director of Technology for their Advanced Electronic Materials business...
