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Remember when device node scaling was the semiconductor superstar, and advanced packaging was the back-up singer? At the 15th Annual IMAPS Device Packaging Conference, held March 5-7, 2019, in Fountain Hills, AZ, it became clear how rapidly that hierarchy has shifted. From the keynotes to the panel discussion, to the...
With heterogeneous integration, 3D, and advanced wafer-level packaging technologies officially declared the rising stars of the semiconductor industry, materials, process and equipment suppliers have pulled out their shiniest bells and whistles. Here’s a sampling of news and products that were on display at IWLCP 2018, October 23-25, 2018 at the...
In recent years, the technology of 3D integration has evolved into an economically interesting road. In particular, the technology is used to package the CMOS imagers you find in your smartphone, the high-bandwidth DRAM memory stacks used in high-end computing, as well as in advanced graphics cards. 3D integration allows...
Semiconductor device fabrication and packaging is rife with acronyms, and by my estimate, the Top 3 trafficked by speakers at the recent IMAPS Device Packaging Conference were the acronyms FOWLP, FOPLP, and MEMS. That would be fan-out wafer level packaging, fan-out panel level packaging, and microelectromechanical systems, respectively. It wasn’t...
FLORIAN, Austria, March 8, 2017—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the IQ Aligner NT—its latest and most advanced automated mask alignment system for high-volume advanced packaging applications. Featuring high-intensity and high-uniformity exposure optics, new wafer...
TEMPE, Arizona – September 1, 2016 – Deca Technologies, a wafer level electronic interconnect solutions provider to the semiconductor industry, announced today the receipt of an additional $51.5 million investment from a leading electronics company. Combined with the previously announced investment from ASE of $60 million, and following the repurchase...
In the bric-à-brac collection that seems to form my particular set of memories and mental associations, I have at least two old somethings crowded in a Berlin corner that I have been looking after for years, a corner to which I have now recently added something new and exciting. And...
For the fourth consecutive year, the Impress Lounge played host to the 3D InCites Awards Ceremony, during which individuals, companies, and products were recognized by their peers for excellence in 3D packaging technologies. This year, we mixed it up a bit, and rather than recognize the processes, materials, designs and...
“Advanced packaging will reach 44% of packaging services and a revenue of US$ 30 billion by 2020,” announces Yole Développement (Yole). Overall, the main advanced packaging market is the mobile sector with end products such as smartphones and tablets. Other high volume applications include servers, PC, game stations, external HDD/USB...
Flanders, New Jersey (February 2, 2015)—Rudolph Technologies, Inc. has shipped the JetStep® Advanced Packaging Lithography System to a leading outsourced assembly and test (OSAT) facility. This new customer will use the JetStep W Series for fan-out wafer level packaging (FO-WLP) applications. “The customer was seeking to add capacity for ramp...
