Matches for your search: "fan-out wafer level packaging "
In the past 16 years, 3D InCites has watched the 3D packaging industry grow. The philosophy of 3D InCites was to create an advanced packaging community. At SEMICON West in Phoenix, the community was out in force, from ribbon-cutting ceremonies for new facilities, to new packaging equipment companies showing for...
At the recent ECTC conference in Dallas, IBM and DECA announced the signing of an agreement to implement Deca’s M-Series and Adaptive Patterning technologies in IBM’s advanced packaging facility in Bromont, Canada. Under this agreement, IBM will establish a high-volume manufacturing line focused on Deca’s M-Series Fan-out Interposer Technology (MFIT)....
Siemens has collaborated with leading Outsourced Assembly and Test (OSAT) company Siliconware Precision Industries Co., Ltd. (SPIL) – (Image courtesy of SPIL) Siemens Digital Industries Software today announced it has collaborated with leading Outsourced Assembly and Test (OSAT) company Siliconware Precision Industries Co., Ltd. (SPIL) to develop and implement a...
Papers to highlight breakthrough capabilities of EVG’s hybrid bonding, LITHOSCALE® maskless lithography and NanoCleave™ layer release technology for advanced packaging applications EV Group (EVG) today announced that new developments in heterogeneous integration enabled by its advanced wafer-to-wafer (W2W) and die-to-wafer (D2W) bonding, lithography, and revolutionary infrared (IR) laser cleave solutions...
The coming-of-age and breakthroughs offered by silicon carbide (SiC) MOSFETs, as well as demand that is outstripping supply are rapidly driving improvements in processing, yield, and reliability learning cycles, and needs for greater industrialization of test & burn-in. SiC MOSFETs offer better overall performance, higher efficiencies, higher switching frequencies, and...
Moving from 2D scaling to heterogeneous integration and 3D packaging is ever-more critical to improving semiconductor device performance. In recent years, advanced packaging technologies have increased in complexity as well as in variability to support a wider range of devices and applications. In this article, we investigate the limitations of...
Heterogeneous integration (HI) is fast becoming a key driver of semiconductor development due to its ability to scale the number of individual chips onto a miniaturized system-in-package that enhances functionality, achieves higher efficiency, and even reduces power consumption. At the recently concluded SEMICON CHINA 2021 Advanced Packaging Forum, Dr KK...
After spending three days in the company of the IMAPS community at the 15th annual IMAPS Device Packaging Conference (IMAPS DPC) March5-7,2019, in Fountain Hills, Arizona, I am once again reminded why I chose to focus 3D InCites on the advanced packaging segment of the semiconductor industry. The technology is...
The semiconductor industry showed impressive figures in 2017: +21.6% year-over-year growth to reach about US$ 412 billion. Without any doubt, the industry is entering a new age, where innovation and disruption are the keywords. In addition to mobile, Yole Développement (Yole) analysts identified emerging mega-drivers that are changing our world step-by-step. Big...
That’s great it starts with an earthquake … R.E.M. Boxing Day 2017 ended with an earthquake in Silicon Valley, at 10:32 pm, a magnitude 3.9 temblor near Alum Rock I thought could have been my neighbor dropping something heavy in the apartment upstairs, except that nobody lifts and drops anything...
