Matches for your search: "fan-out wafer level packaging "
I have spent a considerable amount of time covering the technology associated with the front-, and back end of-the-line. So for me, it is remarkable to see the growth in advanced packaging and how the interest in packaging technology seems to be overshadowing the FEOL transition to gate all around...
The system delivers superior uniformity, enabling performance and cost efficiencies for next-generation chip packaging ACM Research, Inc., a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced its new Panel Electrochemical Plating (Ultra ECP ap-p) tool designed for fan-out panel-level packaging (FOPLP). This new tool employs...
Papers will highlight heterogeneous integration solutions such as hybrid bonding, maskless lithography, and layer transfer technology for advanced packaging applications. EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that new developments in heterogeneous integration enabled by its...
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host a Workshop to discuss and promote strategies to improve On-Shoring Advanced Packaging and Assembly, July 10-12, 2023, in Washington, DC. This workshop will bring Government agencies, the DIB (Defense Industrial Base) and Advanced Packaging and Assembly providers together...
This detailed blog covers how wafers are manufactured and processed, what makes a perfect wafer, and which surface metrology approaches can be used for quality assurance. First… the manufacturing process Microelectronic components and semiconductors are manufactured on round thin discs, referred to as wafers. Wafers can be made of various...
Seed layer deposition is one of the most critical process steps in manufacturing vertical and horizontal interconnects. At the panel level, seed layer deposition must deliver high-performance degas, etch, and sputter deposition processes as well managed substrate temperature throughout the whole process to ensure low contact resistance (Rc) and excellent...
New ECP ap capability controls the wafer-level electric field to deliver better uniformity within wafer and within die while achieving higher throughputs FREMONT, Calif., March 10, 2021 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP)...
Temporary wafer bonding processes were initially developed for enabling three-dimensional (3D) stacked integrated circuits (ICs). For example, dies can be stacked on top of each other using die-to-wafer stacking to create 3D IC stacks. Through-Si vias (TSVs) and microbumps are used to interconnect the finished dies. These techniques require the...
Rolla, Missouri – Sept. 4, 2018 – Brewer Science, Inc. today from SEMICON Taiwan introduced the latest additions to its industry-leading BrewerBOND® family of temporary bonding materials, as well as the first product in its new BrewerBUILD™ line of thin spin-on packaging materials. BrewerBUILD delivers an industry-first solution to address...
New wafer bonder from EVG enables 3-5x throughput improvement for breakthrough cost-of-ownership performance SEMICON EUROPA, Dresden, Germany, October 19, 2010 – EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced the latest...
