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TechSearch International’s teardown of the Apple Watch Series 6 GPS+LTE examined 108 board-level packages plus another 17 packages inside modules and found 27% more wafer level packages (WLPs) than in the previous Series 5, including packages in the wireless charger. Apple used more multi-die modules in the new watch. X-ray...
A number of factors are converging and driving the chiplet design revolution. To start with the economic advantage of silicon scaling is slowing. The semiconductor industry is facing an inflection point as higher cost, lower yield, and reticle size limitations drive the need for viable alternatives to traditional monolithic solutions,...
TEMPE, Arizona – March 18, 2021 – Deca, an industry-leading pure-play technology provider for advanced semiconductor packaging, announced the introduction of its new APDK™ (Adaptive Patterning® Design Kit) methodology. The solution is the result of Deca’s collaboration with Advanced Semiconductor Engineering, Inc. (ASE) and Siemens Digital Industries Software. Deca’s tight...
Unique UV plus direct thermal exposure process brings throughput & performance advantages FREMONT, Calif. – Jan 25, 2021 YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and AR/VR applications, today announced that it has signed an agreement to license Deca Technologies’...
Because IMAPS is a society, there is a strong community aspect to its events. It was good to see that captured at this year’s symposium. I really enjoyed attending the live versions of the Society Awards presentation and the Diversity and Inclusion Roundtable. I also popped into the Student-Industry Roundtable...
Before we start this week’s blog, let me take the opportunity to wish all IFTLE readers a Merry Christmas and Happy New Year. As has been traditional for the past decade-plus, I include a 2019 photo of the granddaughters Hannah and Madeline, who, as you can see, continue to grow...
I’m a huge baseball fan. And while my favorite team, the Arizona Diamondbacks didn’t even make it into the playoffs, it doesn’t mean I’m not glued to my MLB app to keep track of the World Series. I LOVE IT! ALL OF IT! The plays, the jockeying for position, the...
We’ve waited a long time for this, and now it’s here. There is a 3D megatrend happening in semiconductor manufacturing, as scaling alone does not meet the sophisticated computing needs of Industry 4.0 applications like blockchain, 5G, the internet of things (IoT), autonomous transportation, telemedicine, and more. These emerging technologies...
The world wants intelligence in everything, especially things that aren’t nailed down like autonomous cars, and the internet of things (IoT) devices. And suddenly, semiconductors are the hottest game in town. Here’s how some of these trends are impacting suppliers that I spoke with at SEMICON West. The importance of...
The people have spoken! The results of last week’s poll are in, and it looks like the majority of those who participated think we should keep it simple. When it comes to heterogeneous integration nomenclature for package architectures, it should be 2D or 3D. The Back Story The term “2.5D”...
