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SEMI Investment Act Tax Credit to Include Materials Suppliers SEMI, the industry association, has announced support for the introduction of the Strengthening Essential Manufacturing and Industrial Investment Act (the SEMI Investment Act) which would extend the Advanced Manufacturing Investment Tax Credit established under the U.S. CHIPS and Science Act through...
Visit booth #i2326 to connect with Nordson experts on automated high- yield fluid dispensing and plasma treatment for semiconductor advanced packaging Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON Taiwan 2025, September 10-12, booth i2326. On display...
The 2026 IEEE Electronic Components and Technology Conference (ECTC), the premier technical conference and product exhibition for the world’s semiconductor packaging industry, has announced a Call for Papers. ECTC 2026 will take place May 26-29, 2026 at the JW Marriott & Ritz-Carlton Grande Lakes Resort in Orlando, FL. More than...
Achieving High-Volume, Zero-Defect Quality Polymer Purification Brewer Science, Inc., a high-volume manufacturer of ultrapure semiconductor materials, is presenting their latest innovation in polymer purification at the AIChE Conference from October 27th through 31st. Traditional Batch Polymer Precipitation Methods are Inefficient Balancing the industry’s needs to scale materials, while maintaining ultra...
Indium Corporation experts will lead three presentations and a poster presentation at the 57th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), from October 1-3, in Boston, Massachusetts. The first presentation, titled Novel Innovative Thermal Interface Materials for Bare Die Processors and Applications Methods,...
The fan-out wafer level package (FO-WLP) market is projected to grow 15.5% in units from 2020 to 2024. Growth is driven by use in mobile devices such as smartphones and smartwatches, automotive radar, and increasing adoption in high-performance computing. Wafer shipments are driven by adoption in AI accelerators, GPU/CPU, and...
Last time I checked in with Kim Pollard, Technology Manager, Dynaloy, was a few years ago, when we talked about the importance of cleans for 3D ICs. Dynaloy, a subsidiary of Eastman Chemical Company, develops and creates chemistries specifically for the removal of photoresist, etch residues and other polymers. At...
For years, we’ve been talking about the performance and power benefits of 2.5D and 3D ICs. We’ve also been talking about the remaining challenges, and have steadily ticked off the technology-related ones. The “elephant-in-the-room” has been, and continues to be cost. But based on the messages of some key industry...
TSMC calls them 3D Super Chips. The rest of the industry calls it 3D heterogeneous integration. Whatever way you slice it, either 2.5D or 3D IC, it requires TSV technology for its method of interconnect. Here are a few recent items about the latest progress in the march to commercialization...
This was my second year attending the Medical Electronics Symposium, and I’m not sure what I was expecting, but when it came to technology advancements themselves, I noticed that not much exciting has happened since last year. Or maybe I’ve just been spoiled. Not every year can be about earth-shattering...
