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Dr. Dev Palmer Takes over the Reins CHIPS NAPMP The Department of Commerce has announced that Dr. Dev Palmer has joined CHIPS for America’s Research and Development (R&D) Office as the director of the National Advanced Packaging Manufacturing Program (NAPMP). Dr. Palmer joins CHIPS for America from DARPA where he most recently...
You may have heard of the company, Averatek. Founded in 2009 out of the Stanford Research Institute, it developed and licensed chemistries and advanced interconnect technologies for electronics. Although the company specialized in printed circuit boards (PCBs), Averatek’s new leadership saw an opportunity to apply its technology to advanced packaging....
Carlsbad, CA, USA – 5 March 2024 – Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate its latest MARCH and ASYMTEK product divisions equipment for semiconductor manufacturing at SEMICON China 2024, booth 3645. Plasma removes impurities and activates surfaces to enhance flow and adhesion for...
At the 2023 IMAPS Symposium in October, I had some great community member conversations about some of the hot topics of the day. They shared their opinions on everything from the possibility of the U.S. onshoring advanced packaging technology in high volumes, to the impact of germanium and gallium restrictions...
See equipment demonstrations for semiconductor packaging, and talk to Nordson experts in booth E4617 Carlsbad, CA, USA – 27 June 2023 – Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, will demonstrate their latest solutions for semiconductor packaging and electronics manufacturing, with partner AMT at the SEMICON China...
Onto Innovation announced the completion of a newly constructed cleanroom manufacturing area on site in Bloomington. Equipped with 20 new bays, the manufacturing floor will initially be used to build Onto’s edge and backside inspection modules, its probe card test and analysis systems, and its wafer handling modules. NHanced Semiconductors...
Founder’s Award honors individuals who have made the most significant contributions to the microelectronics packaging industry Tempe, Ariz. – October 18, 2022 – Deca Technologies, a leading provider of advanced electronic interconnect technology, is proud to announce that its founder and CEO, Tim Olson, was awarded the International Microelectronics Assembly...
TechSearch International’s latest analysis describes high-performance package options with an update on TSMC’s new offerings, including the latest organics CoWoS® versions. New high-end product examples using fan-out on substrate are discussed. Features of the build-up substrates supporting redistribution layer (RDL) structures are provided. Applications for high-performance wafer-to-wafer hybrid bonding are...
ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, reveals the details of its third-generation flagship thermal debond machine, ADM330. The machine was introduced to the market in 2007 as the first-of-its-kind. Since then, it has become an industry-favourite and can be found on...
A number of factors are converging and driving the chiplet design revolution. To start with the economic advantage of silicon scaling is slowing. The semiconductor industry is facing an inflection point as higher cost, lower yield, and reticle size limitations drive the need for viable alternatives to traditional monolithic solutions,...
