Passing the Torch: Reflections from SEMICON Europa 2025
Nov 24, 2025 · By Francoise von Trapp · Blogs, Francoise in 3D
Latest Posts - Page 9
Research Scientist, Maaike M. Visser Taklo, Rises to Her Own Challenge
Throughout my years of writing about the semiconductor industry, I’ve met women from all over the world. I’ve often wondered...
Diversification of Markets Calls for Hybrid Metrology with Multi-Sensor Technology
It used to be that people thought about metrology for front-end process control and inspection for advanced packaging. As wafer...
How Jessica Gomez Short-Circuited Her Way to CEO: A SemiSister Success Story
The number is sobering: according to the U.S. Bureau of Labor of Statistics, 16.9% of chemical engineers and 12.3% of...
It’s not the Data, it’s what you DO with it; and Other Conversations from SEMICON West 2018
Emerging technologies like artificial intelligence (AI), machine learning (ML) are driving more than just the semiconductor market. They also drove...
Volumes Matter and Other Conversations from SEMICON West 2018
The world wants intelligence in everything, especially things that aren’t nailed down like autonomous cars, and the internet of things...
Why We need Lower Cost TSVs and How to Get Them
Through-silicon vias (TSVs) have been firmly established as a method of interconnect that enables high bandwidth and low latency between...
What Should Replace “2.5D” in the Heterogeneous Integration Nomenclature?
The people have spoken! The results of last week’s poll are in, and it looks like the majority of those...
SEMICON West 2018: Smart Starts Where?
Well, that was interesting. SEMICON West 2018 just wrapped up, and I’m not quite sure what just happened. This year’s...
3D InCites Top Picks for SEMICON West 2018
Ok folks. It’s that time of year again. SEMICON West 2018 is upon us. By the time you read this...
Are you Team 3D, 2.5D or 2DS/2DO?
The Heterogenous Integration Roadmap Committee wants to create a new nomenclature that does away with 2.5D. Instead, the industry will...
An Update on the Fan-out Panel-Level Packaging Consortium
One topic that has been under hot debate in the semiconductor advanced packaging sector for the past few years is...
Transforming the Fan-out Landscape
These days, the first thing that comes to mind when someone mentions fan-out (FO) technology is Apple’s A10 processor built...
Tech Round-up from ECTC 2018
For the past few years, the ECTC committee has provided 3D InCites with a table outside the session rooms, rather...
Co-Design Comes to ECTC 2018: You Can Lead A Horse to Water…
Despite a valiant effort by the ECTC committee to integrate design topics into this year’s agenda, the number of empty...
Special ECTC 2018 Session Focuses on Frontiers in Assembly Technology
The special Tuesday session at ECTC 2018 took a look at new methods and applications for assembly technology to accommodate...
Fan-out is Hot, 3D Is Back, and 5G is Needed: The Inside Scoop from ECTC 2018
There’s fact, and there’s perception. The messages people carry away from conferences are not only influenced by what they hear...
The Heterogeneous Integration Roadmap Explained by Bill Chen
Festivities at ECTC 2018 kicked off May 29, 2018, with a full-day Heterogeneous Integration Roadmap (HIR) Workshop. This workshop was...
ECTC 2018 Paves the Path to Heterogeneous Integration
For nine years, my fellow 3D InCites bloggers and I have been evangelizing about the wonders the microelectronics industry can...
Bitcoin and Beanie Babies: Why Cryptocurrency Volatility Matters to the Semiconductor Industry
Bitcoin, a cryptocurrency built on blockchain, has become one of the hottest topics to hit the semiconductor news feeds and...
