CMP Technology for the Next Generation of Substrates
Oct 06, 2025 · By Roland Rettenmeier · 3D In-Depth, Manufacturing
Latest Posts - Page 5
A Smorgasbord of 3D News
Sometimes there’s just a bunch of random stuff that catches my eye over the course of a week, and I...Himax Technologies Selects EV Group to Expand Production Capacity for Wafer-Level Optics
Repeat Order for IQ Aligner Further Solidifies EVG’s Position as Leading Microlens Molding Solutions Provider for Wafer-level Camera Applications St....Glass vs. Silicon Interposers for 2.5D and 3D IC Applications
There has been enough interest stirred up in R&D around glass as a low-cost alternative interposer substrate material compared with...Mitsubishi Throws its Hat in the 300mm Wafer Bonding Ring
Earlier this week, Mitsubishi Heavy Industries, Ltd. announced it had “developed the world's first fully automated 12-inch (300 millimeters) wafer...SEMATECH to conduct rigorous manufacturability assessments to enable high volume manufacturing readiness of 3D technology
To enable high-volume production readiness of 3D-based products, SEMATECH’s 3D Interconnect and Manufacturability programs will be conducting Equipment Maturity Assessments...Altatech Semiconductor’s 300 mm CVD System Being Used in 3D IC Pilot Production at ASSID
All Silicon System Integration Dresden (ASSID), a leading-edge microelectronic wafer-level packaging and system integration center operated by the Fraunhofer IZM...Perspectives on 3D Integration: The Researchers
To listen to John Lau, of ITRI, speak on the topic of 3D integration is to experience a passion for...SPTS Wins New 300mm PVD Order from CEA-Leti
SPP Process Technology Systems (SPTS), has received a follow on purchase order from CEA-Leti for its Sigma® fxPTM Physical Vapor...Georgia Tech’s 3D Interposer Technologies Provide Low-cost 3D Option
At SEMICON West 2011, Prof. Rao Tummala of Georgia Tech presented the unique glass and silicon-based 3D Interposer technologies being...Shanghai Simgui Technology Places Follow-on Order for EVG Wafer Bonder; Advances to Fully Automated SOI Wafer Production
ST. FLORIAN, Austria, November 8, 2011 — EV Group (EVG) , a leading supplier of wafer bonding and lithography equipment for...
