Devices

Courtesy of Governor Cuomo's press office

Nano Utica gets $1.5B Infusion; Probably Good Die Revisited; Developments in Monolithic 3D

Word on the street is, New York will soon be known as Nano York, with all the money the state is pouring into nanotechnology research and development. The most recent announcement by Governor Cuomo is a $1.5 Billion Public-Private investment intended to turn the Mohawk Valley (Utica) into the next major hub for nanotechnology research. A consortium of global technology companies headquartered at t... »

3D NAND

3D NAND Flash – Towering Spires or Costly Canyons?

The transition to 3D NAND Flash seems to be imminent with projections of it being half the total NAND Flash market by 2016. That means tens of billions of dollars within 3 years. V-NAND is Samsung’s version. Their first publication describing this architecture was released in 2009 and was called “TCAT” or “Terabit Cell Array Transistor”. Toshiba too has been working o... »

TSMC 3D IC Reference Flows; A Leap Forward for the HMC

TSMC 3D IC Reference Flows; A Leap Forward for the HMC

Big news for 3D ICs this week as TSMC and its OIP Ecosystem Partners announce the release of silicon-validated reference flows for both 3D IC stacks and 16nm FinFETS (everyone else puts the 16nm FinFETS first, but I’m most excited about the 3D IC news.) According to Peter Clarke in EETimes, “silicon validation of these flows signifies the opening up of the manufacturing processes for the desig... »

Getting back to Basics: a Look at 3D NAND and 3D DRAM

Getting back to Basics: a Look at 3D NAND and 3D DRAM

There’s been a lot of buzz around 3D NAND in the past few weeks, sparked by Samsung’s recent announcement that it was commercializing its 3D VNAND technology. There’s also been some discussion (mixed with concern) about how, if at all, 3D NAND might affect the commercialization of TSV-based 3D DRAM technologies, such as Wide I/O 2, High Bandwidth Memory (HBM) the current front-runner, Micron... »

3d NAND

Comparing Samsung’s 3D NAND with Traditional 3D ICs

At last week’s Memcon 2013, which took place Tuesday, August 6, 2013, at the Santa Clara Convention Center, Keynoter Bob Brennen, Senior VP at Samsung, talked about the need for New DRAM and Flash Memory architectures. Richard Goering summarized Brennan’s keynote very well in his blog post. Because Brennan’s responsibility is to manage Samsung’s System Architecture Labs, he talked ... »

Momentum Builds for the 2013 3D InCites Awards

Momentum Builds for the 2013 3D InCites Awards

Subscribers are practically blowing up 3D InCites as they duke it out online and race the  July 3rd deadline for casting their ballots in the public opinion poll for this inaugural 3D InCites Awards; which is great because the first 3D InCites Awards Breakfast, co-presented by 3D InCites and TechSearch International, is fast approaching, and we’ve got an exciting program shaping up. We’re hap... »

2.5D Interposer wafer - TSMC

3D Buzz from ConFab, 3D Integration at IITC 2013, and more

So SPIL’s offering a turnkey model for 2.5D interposers, including fine-pitch fabrication of the interposer wafers themselves? This is certainly an interesting turn of events, particularly with TSMC’s recent announcement that they’re not married to the turnkey model and are willing to collaborate with OSATS. SST’s Phil Garrou got the scoop this week from SPIL’s Mike Ma, at the Confab. Re... »

Technology Updates at ECTC 2013

Technology Updates at ECTC 2013

The ECTC 2013 stats are in. This year showed increases across the board with: Over 1,300 attendees, the highest attendance ever, from 26 countries 377 technical papers, presented in 36 oral and five interactive presentation sessions, including a student poster session 12 sessions focused on 3D/TSV, including several of the best attended sessions of the conference 16 professional development course... »

3D InCites and TechSearch International Launch Awards Program To Recognize Achievements in 2.5D and 3D IC Technologies

3D InCites and TechSearch International Launch Awards Program To Recognize Achievements in 2.5D and 3D IC Technologies

Proceeds to Benefit The Frances B. Hugle Engineering Scholarship Phoenix AZ and Austin TX – May 21, 2012 – 3D InCites, the premiere online content source for reliable 3D technology information, and TechSearch International, the leading market research and intelligence firm for advanced semiconductor packaging technology, today announced the first annual 3D InCites Awards. All proceeds of the a... »

tablets and smartphone

Reinventing the PC; MEMS and LEDs Grow Up

The PC world is dead?  Chris Hubbard, Intel’s Business PC Marketing Manager scoffs at the mere idea. “The demise of the PC industry was predicted before it was born!” he said during his opening presentation at the SEMI Americas Arizona Breakfast Forum, Friday April 12, 2013 at Intel in Chandler, AZ. Hubbard showed a chart contrasting PC revenue growth with different times over the years whe... »

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