How AiP Technology Helps Enable 5G and More
Jun 04, 2020 · By Amkor Technology · 3D In-Depth, Devices
Latest Posts - Page 2
Ye Antique Towers – Samsung’s 3D NAND Flash SSD 850 Pro
Samsung’s introduction of its 3D NAND Flash SSD 850 Pro has led to the inevitable hullabaloo. Amid all the fuss, it hasn’t...
Intel’s Next-Gen Xeon Phi processor to have Micron 3D Memory Inside
Somehow in all my preparations for the 2014 3D InCites Awards and planning the schedule for SEMICON West this week,...
SORIN CRM: 3D IC Module for Active Medical Implant
Manufacturing of 3D IC heterogeneous integrated modules for the electronics of a leadless pacemaker in a very small volume has... Schiltron 3D Flash
Schiltron 3D Flash replaces 2D-NAND. It uses a unique architecture solving key challenges associated with other 3D-NAND approaches: scalable; no... Novati Technologies: Silicon Interposer Module
The 2.5D Interposer Module features three front-side interconnect layers of dual-damascene copper on top of a single-damascene copper metal layer,...
3D NAND Flash – Schiltron’s Answer
It probably appears that the only 3D technologies vying for 2D NAND’s crown are V-NAND from Samsung and p-BiCS from...
3D NAND Flash – Towering Spires or Costly Canyons? – Part 4
If you’ve followed me thus far in the three preceding posts, well done! We started by questioning the cost assumptions....
Part 2: 3D NAND Flash: Towering Spires or Costly Canyons?
In my last blog posting I went over the cost aspects of the Samsung-Toshiba 3D NAND approaches. The conclusion is...
What Node Names Really Mean; The TB/DB Saga continues; HMC update
Did you know that when foundries talk about 14nm and 16nm node chips, these devices are in reality no denser...