Previews of IEDM 2012, which got underway today in San Francisco, indicate a program this year rich in content on 3D transistors and 3D memory technologies, with very little focus on 3D ICs using TSVs. My take on this is that IEDM papers are generally focuses on processes and technologies in early development. So while there was a lot to talk about in past years, 3D TSV technologies have matured past the scope of IEDM’s focus.
In his IEDM Preview post on ZDnet, John Morris says this is the first time Intel will talk about how its 22nm technology, already used in laptops, PCs and data centers, with FinFETs will translate to Atom mobile processors for the increasingly important smartphone and tablet markets. Other leading edge foundries like TSMC will also be talking up their FinFET technologies, he says, and others will be promoting their progress in FD-SOI. Memory technologies will also be center stage, and John says he’ll be posting update throughout the week.
Don Scansen IP Research Group also posted a preview analysis of IEDM here on EETimes, calling IEDM’s offerings this year “a mix of futuristic academic research and evolutionary industrial technology approaching commercialization.” He notes that non-volatile memory – and particularly 3D NAND papers dominate this year’s agenda. Scansen shares his picks with readers who need some guidance on not-to-be-missed presentations. But that was yesterday’s post. Today in IEDM Goes Deep on 3D Circuits. Scansen updated his recommended picks to include papers related to cooling 3D circuits – noting presentations by Rambus, Stanford University, and MonolithIC 3D.
In her post today titled, Intel’s 22-nm tri-gate SoC, how low can you leak? Sylvie EETimes Silvie Barak previewed Intel’s paper, describing how its 22-nm tri-gate (FinFET) SoC technology has been adapted to suit mobile applications.
For a preview of the entire 2012 IEDM program, Solid State Technology has posted a slide show featuring 14 papers here.
I will be heading up to San Francisco in time to attend 3D ASIP later this week, and will bring you full coverage of that event up close and personal. ~ F.v.T