SEMICON Europa 2025 Member Preview
Oct 28, 2025 · By Jillian McNichol · 3D Event Coverage
Latest Posts - Page 7
3D ASIP Returns Under The IMAPS Umbrella for Its 13th Edition
In less than two weeks, the 13th Annual Architectures for Semiconductor Integration and Packaging Conference (3D ASIP) kicks off at...
What’s New for the 2017 European 3D Summit
For the fifth consecutive year, the European 3D Summit returns to Grenoble, January 23-25, 2017. The event has evolved over...
MEMS & Sensors Executive Congress 2016 Sets Out to Conquer the Internet of Countless Things
A shift has occurred. As MEMS becomes mainstream, the focus of the annual MEMS & Sensors Executive Congress (MEC 2016)...
IWLPC 2016 Keynotes Look to A Connected Future Enabled by Advanced Packaging
The 2016 International Wafer-Level Packaging Conference (IWLPC), which took place October 18-20, 2016 in San Jose, CA, focused on a...
MEMS & Sensors Industry Group Reveals Tech Showcase Finalists
MEMS & Sensors Industry Group (MSIG)’s annual MEMS & Sensors Technology Showcase at MEMS & Sensors Executive Congress® 2016 (November...
Top Ten Reasons to Attend the 2016 European MEMS Summit
Ok everybody, here it is, back by popular demand: the TOP TEN reasons (this time told in photos) why you...
SEMICON Europa Advanced Packaging Conference Looks at Consumer and Harsh Environment Packaging
System integration is moving forward. Denser and high performing systems require advanced packaging, assembly, and test players to move closer...
Leading Market Analysts to Explore Future of MEMS at the European MEMS Summit
The second annual European MEMS Summit takes place in Stuttgart, Germany, on September 15-16, 2016. In addition to top MEMS technologists, the...
Heterogeneous Integration enabled by Advanced Packaging Leads the Way at SEMICON West 2016
I have to admit, after attending this week’s SEMICON West 2016, I’m feeling a little smug. Why? Because after years...
3D InCites Guide to SEMICON WEST 2016
In past years, we have provided 3D InCites readers with a guide for navigating through the myriad programs that specifically...
DAC 2016: There is More to Life than IC Design, Part 2
Part 1 of my DAC 53 reporting focused on this year’s really impressive keynotes, now posted on the DAC website,...
Meet Me at ECTC 2016 in Las Vegas
With the industry-wide shift in focus from furthering Moore’s Law to the realization that 3D integration and advanced packaging technologies...
What to Expect on 3D Integration and IoT at the 2016 Symposium on VLSI Technology
If you’re planning to attend this year’s combined Symposium on VLSI Technology and Circuits, themed “Inflections for a Smart Society,”...
The European 3D Summit: From Roadmaps to Reality
In its fourth edition and with a new name, the European 3D Summit (formerly the European 3D TSV Summit) reflected...
At 3D ASIP 2015, Variety is the Spice of Life
Staying relevant in the ever-expanding technology landscape that is the semiconductor packaging industry can be a struggle for an event that’s...
The IPSO Alliance IoT Pavilion at Designers of Things Brings Smart Ideas to Life
Have you ever met someone who actually built a better mousetrap? What about someone who came up with the idea...
Executive Viewpoint: Why the European 3D Summit is Going Beyond TSVs
Remember back a few years ago when 3D and TSV were considered to be the pretty much the same thing?...
Questions Answered at the 2015 MEMS Executive Congress
This final post from my time at the 2015 MEMS Executive Congress addresses some random questions I had that were...
System-level Scaling: UCLA’s Answer to Extending Moore’s Law
“We are at a crossroads. Current chip design is nearing its capacity. The time, expense, and effort needed to make...
