They call me the “Queen of 3D” because I have been following the course of 3D integration and blogging about it since 2009. Francoisein3D is the featured blog on this site.
Outsourced Semiconductor Assembly and Test (OSAT) provider, STATS ChipPAC Ltd., has announced qualification of its 300mm middle-end-of-line (MEOL) manufacturing operation for...
This week’s webinar on chip stack assembly simulation, presented by Kamal Karimanal of Cielution offered some useful information on how modeling can...
