Siemens has collaborated with leading Outsourced Assembly and Test (OSAT) company Siliconware Precision Industries Co., Ltd. (SPIL) – (Image courtesy...
If you are designing a heterogeneously integrated, multi-die, high-performance device for markets such as HPC, AI, data centers, etc., then...
While most of us in advanced packaging is familiar with CEA-Leti, CEA-List ( Laboratoire d’Intégration de Systèmes et des technologies)...
For the first time in 3D InCites’ history, I was invited to attend a TSMC Technology Symposium, which took place...
The 19th Annual Device Packaging Conference (DPC 2023) is scheduled for next week, March 13-16, 2023, at the WeKoPa Conference...
Jean-Marie Brunet, Vice President and General Manager of the Siemens Hardware-Assisted Verification business unit finds himself and his group in...
SEMI announced that SEMICON West will move to Phoenix on a five-year annual rotation, beginning in 2024, and will shift...
Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968,...
Siemens Digital Industries Software today announced that Chipletz, an innovative fabless substrate startup, has selected Siemens as its strategic electronic...
Happy Holidays! Here’s the last of our community news round-up for 2022. Can’t wait to see what’s in store for...
Onto Innovation announced the completion of a newly constructed cleanroom manufacturing area on site in Bloomington. Equipped with 20 new...
CHIPS Act Innovation Hubs SEMI has published an interesting article where they predict 10 likely locations for CHIPS Act Innovation...
SEMICON Europa kicks off next week as microelectronics experts and visionaries gather for insights into advanced technologies that are driving...
Acquisition will extend Siemens’ enterprise verification platform, adding Avery‘s Verification Protocol and Compliance Test Suite offerings Customers can optimize quality...
Welcome to our new monthly community member news in review where we will highlight community news, events, milestones, anything worth...
Siemens’ Capital™ Electra™ X is a new cloud-native electrical design software aimed at individual electrical designers or small teams that...
Siemens Digital Industries Software today announced that Samsung Foundry has certified Siemens‘ Aprisa™ solution for the foundry’s advanced 4nm FinFET...
Welcome to our new monthly community member news in review where we will highlight community news, events, milestones, anything worth...
The 55th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week in Boston with...
Siemens’ Tessent Multi-die software helps customers dramatically speed and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based...
