metrology

UnitySC Unveils New Inspection System for the Advanced Packaging and Wafer Processing Ecosystem

UnitySC Unveils New Inspection System for the Advanced Packaging and Wafer Processing Ecosystem

Grenoble, France (November 8, 2018)— UnitySC European leader and a key player in inspection and metrology solutions, today launched the Unity_LIGHTiX ™ system for micro/macro all surface inspection and 2D/3D metrology. This new inspection and metrology system has been designed to address multiple applications including redistribution layers (RDL) down to 2/2 µm line/space, as well as µbump i... »

UnitySC Opens New Asia Entity to Support Advanced Packaging and Power Device Markets

UnitySC Opens New Asia Entity to Support Advanced Packaging and Power Device Markets

Hsinchu, Taiwan – May 8, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced the opening of its Asia subsidiary, Unity Semiconductor Limited Company (UnitySC Asia). The entity was established to deliver enhanced customer support for UnitySC’s growing installed base of inspection and metrology tools throughout the region. UnitySC Asia is headquartered at T... »

Rudolph Technologies Launches New Truebump Technology at SEMICON Taiwan 2017

Rudolph Technologies Launches New Truebump Technology at SEMICON Taiwan 2017

Wilmington, Mass. (September 11, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announces new Truebump™ Technology on the Dragonfly™ Inspection System. Truebump Technology provides fast, accurate and repeatable three-dimensional (3D) metrology for all advanced packaging bumping applications, from copper (Cu) pillar, to micro-bumps, and even large C4 bumps. With the Dragonfly system, the advan... »

UnitySC Pushes The Boundaries of Measurement with New Nanotopography Metrology Platform

UnitySC Pushes The Boundaries of Measurement with New Nanotopography Metrology Platform

Grenoble, France, March 14, 2017 – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today introduced its new NST Series at SEMICON China in Shanghai. The NST Series is the world’s first non-contact metrology solution for accurately measuring the nanoscale surface topography of semiconductor wafe... »

Process Control Gains Importance in Advanced Packaging Applications

Process Control Gains Importance in Advanced Packaging Applications

2016 will be remembered as the year fan-out wafer level packaging (FOWLP) went mainstream, thanks to TSMC’s strategic move in the advanced packaging arena and especially its integrated fan-out (InFO) win inside the iPhone 7. Already in high-volume manufacturing (HVM), FOWLP volumes significantly increased in magnitude. Will this strong momentum continue over the next few years? I believe it will... »

EV Group Rolls Out Automated Metrology System for Advanced Packaging, MEMS and Photonics Manufacturing

EV Group Rolls Out Automated Metrology System for Advanced Packaging, MEMS and Photonics Manufacturing

FLORIAN, Austria, July 11, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®50 automated metrology system. Designed to support the increasingly stringent manufacturing requirements for advanced packaging, MEMS and photonics applications, the EVG50 performs high-resolution non-destr... »

FOGALE Nanotech Acquires Altatech: Expanded Portfolio Includes Wafer Inspection and Deposition Tools

FOGALE Nanotech Acquires Altatech: Expanded Portfolio Includes Wafer Inspection and Deposition Tools

Nimes, France, April 15, 2016 – FOGALE Nanotech today announced that it has acquired Altatech, a specialized technology leader in the development of wafer inspection and material deposition tools for semiconductor manufacturing. Altatech SAS has headquarters in Grenoble, France, located in the center of the French Silicon Valley with a commercial subsidiary in Germany. This strategic acquisition... »

Rudolph Technologies’ NSX 330 Series Widely Adopted for Advanced Packaging Inspection and Metrology

Rudolph Technologies’ NSX 330 Series Widely Adopted for Advanced Packaging Inspection and Metrology

Flanders, New Jersey (September 1, 2015) — Rudolph Technologies, Inc. (NYSE: RTEC) announced the widespread adoption and success of its newest macro defect inspection tool, the NSX®330 Series. The NSX 330 Series provides high-speed macro defect inspection and 2D and 3D metrology for advanced packaging applications, which are being developed to support the mobility and the growing Internet of T... »

Semiconductor Supplier Updates from SEMICON West 2015

Semiconductor Supplier Updates from SEMICON West 2015

No SEMICON West would be complete without a few laps around Moscone North and South, and some one-on-one chats with suppliers. I stopped in to see several semiconductor supplier companies who annually request an audience with the Queen of 3D to talk about their latest accomplishments, as well as gain some insight on their perspective of the industry. I had my 9th annual briefing with Manish Ranjan... »

Executive Viewpoint: Providing A Golden Boat of Wafers

Executive Viewpoint: Providing A Golden Boat of Wafers

As 3D integration technologies become established in low volume manufacturing, the supply chain is gearing up to address high volume manufacturing challenges so that ultimately, these technologies can be used in consumer products. Cost is king, and industry-wide efforts are focused on lowering it. We talk a lot about optimizing technology on 3D InCites, but we don’t often look at what can be don... »

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