Latest Posts - Page 2
UnitySC Opens New Asia Entity to Support Advanced Packaging and Power Device Markets
Hsinchu, Taiwan – May 8, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced the opening...
Rudolph Technologies Launches New Truebump Technology at SEMICON Taiwan 2017
Wilmington, Mass. (September 11, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announces new Truebump™ Technology on the Dragonfly™ Inspection System. Truebump Technology...
UnitySC Pushes The Boundaries of Measurement with New Nanotopography Metrology Platform
Grenoble, France, March 14, 2017 – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection...
Process Control Gains Importance in Advanced Packaging Applications
2016 will be remembered as the year fan-out wafer level packaging (FOWLP) went mainstream, thanks to TSMC’s strategic move in...
EV Group Rolls Out Automated Metrology System for Advanced Packaging, MEMS and Photonics Manufacturing
FLORIAN, Austria, July 11, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology... FOGALE Nanotech Acquires Altatech: Expanded Portfolio Includes Wafer Inspection and Deposition Tools
Nimes, France, April 15, 2016 – FOGALE Nanotech today announced that it has acquired Altatech, a specialized technology leader in... Rudolph Technologies’ NSX 330 Series Widely Adopted for Advanced Packaging Inspection and Metrology
Flanders, New Jersey (September 1, 2015) — Rudolph Technologies, Inc. (NYSE: RTEC) announced the widespread adoption and success of its newest...
Semiconductor Supplier Updates from SEMICON West 2015
No SEMICON West would be complete without a few laps around Moscone North and South, and some one-on-one chats with...
Executive Viewpoint: Providing A Golden Boat of Wafers
As 3D integration technologies become established in low volume manufacturing, the supply chain is gearing up to address high volume...
Genmark Automation Launches CODEX Stocker; Industry’s First Integrated Stocker, Sorter and Metrology System
Tool frees up valuable fab floor space for production equipment; allows for internal expansion of manufacturing capacity Fremont, Calif., July...
KLA-Tencor: CIRCL-AP™
CIRCL-AP™ is a cluster tool with multiple modules, covering all-surface inspection, metrology and review at high throughput for efficient advanced...
Executive Viewpoint: The Impact of Process Control on FOWLP and 3D IC
As Si interposer and 3D stacked memory devices enter into production, albeit in low volumes, semiconductor manufacturers are lining up...
2014 3D InCites Guide to 3D at SEMICON West
I can’t believe it’s already been a year since I last posted my annual guide to 3D at SEMICON West. ...
KLA Tencor: CV310i Wafer Edge Inspection and Metrology Module
CIRCL CV310i module is an advanced Wafer Edge inspection, metrology and profiling system tailored for Advanced Wafer Level Packaging. Simultaneous... NORDSON Dage: XM8000 Wafer X-ray Metrology Platform
Fully automatic, in-line X-ray metrology platform for the measurement and defect capture of both optically hidden and visible features in...
Nimes, France: Influencing 3D Architectures for 2000 Years
I first visited Nimes, France when I was sixteen, on one of those whirlwind, ten-day, school-organized trips with my French...
Europe in 3D: Nordson DAGE Sets Out to Measure the Invisible
What better place for the Queen of 3D to start out her Europe in 3D tour than a late lunch...
Rudolph Technologies’ Metrology, Inspection and Lithography Solutions for 2.5D and 3D TSVs
Here’s one thing the team at Rudolph has a firm grasp on: understanding that feature sizes of today’s wafer-level, 2.5D...
