Latest Posts - Page 5
KLA Completes Acquisition of Orbotech Ltd.
MILPITAS, Calif., Feb. 20, 2019—KLA-Tencor Corporation (NASDAQ: KLAC) today announced the completion of the acquisition of Orbotech Ltd. (NASDAQ: ORBK). “We...
Why Today’s Advanced Packages Need Better Inspection and What’s Being Done About It
It’s almost ironic. As CMOS scaling (aka: Moore’s Law) has slowed due to the increased complexity and cost of achieving...
High Productivity UBM/RDL Deposition by PVD for FOWLP Applications
Fan-out wafer level packaging (FOWLP) technology is an increasingly popular solution for obtaining high levels of device integration with a...
First-Mover Advantage: Fan-Out Panel Level Packaging at IWLPC 2016
“It is better to be first than it is to be better.” (Ries and Trout, in The 22 Immutable Laws...
SPTS sees a Brighter 2016
In contrast to some of the gloomier predictions of the analysts, we think 2016 will be a growth year for...
In Conversation with Yann Guillou About the SEMI European MEMS Summit 2015
Yann Guillou, Membership & Business Development, SEMI Europe, talked with 3D InCites / 3D+ about the upcoming European MEMS Summit...
SPTS Technologies Receives Supplier Excellence Award from Analog Devices
YAVNE, ISRAEL, April 20 2015 | ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and supplier...
Riding Out on a Horse and in on a Goat: 3D IC Predictions for MEMS
The Lunar New Year is soon upon us, and we will be celebrating the Year of the Goat with firecrackers,...
Semiconductor Equipment Manufacturer Consolidation Update
It was a much-talked-about topic this year at SEMICON West 2014 (SW2014) – this trend of semiconductor equipment manufacturer consolidation....
Having the Courage to Design in 3D TSVs
I don’t know why it still surprises me to read conflicting reports on the progress of 3D TSVs. But I... SPTS Technologies and CEA-Leti / Nanoelec RTI collaborate on 3D TSV Technology
Leading Semiconductor Equipment Maker and Renowned European Research Institute to Collaborate in Advanced Packaging Technologies under the Framework of Nanoelec RTI...
Fine Tuning Processes for TSV Reveal
Through silicon via (TSV) reveal is a critical part of the wafer-thinning step in 3D IC backside processing, where the...
Glass Interposers Take the Stage at ECTC 2014
I have to admit, for some time I’ve been fairly skeptical about glass interposer technology as a viable alternative to... SPTS Technologies Announces the Omega® Rapier XE System for 300mm Wafer Silicon Etch Processing
Newport, United Kingdom, 22 May, 2014 – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor...
Process Improvements Target 3D IC Cost of Ownership
Customers have asked and suppliers are listening. One sign of progress from last year to this year at SEMICON Singapore’s...
3D Wafer Level Packaging: Outlook for 2014
In 2013, SPTS equipment sales into the advanced packaging market grew by 75%. Some of this was due to a...
SPTS: ReVia Endpoint System
Product Description ReVia is a new endpoint detection (EPD) technique that can monitor the progress of “via reveal” etch processes... SPTS Ships 1000th DRIE Process Module
Milestone shipment extends company’s leadership in DRIE Newport, United Kingdom, and SEMICON Singapore, 7 May, 2013 – SPTS Technologies, a supplier...
