Latest Posts
The ECTC Time Machine: Lead-free Solder, Environmental Reporting, and Next-Generation Sensors
Attending ECTC 2019 this year was like a trip through a time machine. From my post at the 3DInCites booth,...
ECTC 2019 Will Go Back to Basics to Plan for the Future of Microelectronics and Packaging
Whoa! Where did the time go? ECTC 2019 is only three weeks away and I haven’t written my annual preview...
Impressions from ECTC 2017
Let’s start with the indoor rainstorm. I arrived at the Swan and Dolphin in Orlando just in time for the...
Meet Us at ECTC 2017 in Walt Disney World
As each year passes, advanced packaging technologies offer more versatile solutions for cost-effective low-end applications, while 3D integration advancements continue...
Should EDA vendors, OSATS, and their customers cooperate more?
Last week, I attended the packaging-focused 64th Electronic Components and Technology Conference (ECTC) 2014 in Orlando. This week I spent...
ECTC 2014: A Preview of 2.5D and 3D Activities
Each year, the agenda of Electronic Components Technologies Conference (ECTC), an international conference sponsored by the IEEE Components, Packaging, and Manufacturing...News in 3D: the plot thickens at ECTC
Gossip flies at industry events. But usually as soon as someone tells me something juicy, they follow up with “but...