Fan-out Panel-level Packaging Comes to the ECTC Technology Corner
On my annual trek around the ECTC Technology Corner, I’m always on the look-out for something new to write about. This year, it quickly became clear by the number of exhibitors displaying their product samples, that one of my blogs would be an update on fan-out panel-level packaging. For the past few years, fan-out panel-level packaging (FOPLP) has been in hot debate: is it needed? Does it REALL... »
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