On my annual trek around the ECTC Technology Corner, I’m always on the look-out for something new to write about. This year, it quickly became clear by the number of exhibitors displaying their product samples, that one of my blogs would be an update on fan-out panel-level packaging. For the past few years, fan-out panel-level packaging (FOPLP) has been in hot debate: is it needed? Does it REALL... »
Attending ECTC 2019 this year was like a trip through a time machine. From my post at the 3DInCites booth, I talked to people I’ve known for decades and others I was meeting for the first time. By visiting booths and listening to presentations, I gained insight into how the semiconductor packaging industry has evolved in the past decade and why work I did ten or 25 years ago is newly relevant. E... »
Whoa! Where did the time go? ECTC 2019 is only three weeks away and I haven’t written my annual preview post! This year’s event takes place at the Cosmopolitan in Las Vegas, from May 28-31. I’m excited to announce that my good friend and SemiSister, Nancy Stoffel, General Electric Research is this year’s General Chair. I’d tell you about our escapades the last time ECTC was in Las Vegas.... »
Let’s start with the indoor rainstorm. I arrived at the Swan and Dolphin in Orlando just in time for the fan-out plenary session of ECTC 2017, so tossed my stuff in my room and headed on in (wearing jeans, no less!) You can read about that here. Afterward, I had a bite to eat with industry colleagues. Back in my room at 11:15 to call it a night, only to find it raining ON my bed thanks to a leak... »
As each year passes, advanced packaging technologies offer more versatile solutions for cost-effective low-end applications, while 3D integration advancements continue to improve the performance of leading-edge products. This will be reflected at the 67th Annual Electronic Components and Technology Conference (ECTC), which takes place May 30, June 2, 2017, at the Walt Disney World Swan & Dolph... »
Last week, I attended the packaging-focused 64th Electronic Components and Technology Conference (ECTC) 2014 in Orlando. This week I spent three days at the EDA-focused 51st Design Automation Conference in San Francisco. In addition to realizing that these two locations are about three thousand miles apart, I noticed that the packaging and EDA camps are still far apart in regards to share of mind ... »
Each year, the agenda of Electronic Components Technologies Conference (ECTC), an international conference sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society (CPMT), is jam-packed full of tutorials, keynotes, panels, technology sessions, and interactive poster sessions covering the latest developments and emerging technologies in microelectronics components and pack... »
Gossip flies at industry events. But usually as soon as someone tells me something juicy, they follow up with “but you can’t write about that yet.” Do you realize how hard that is? When, WHEN can I tell? Other times, I guess the answer, and can tell I’ve hit the nail on the head by the silent response and look on the interviewee’s face. But still, I’m sworn to secrecy with the promise ... »
I’ve long been fascinated with the vernacular of the semiconductor industry, which is riddled with acronyms that can often mean different things whether you’re referring to front-end or back-end applications. Additionally, as 3D technologies have developed, so has a whole new set of terms that are evolving right along with the processes. It certainly makes for interesting discussion, as I fou... »
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