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IFTLE 492: Will Intel Acquire GlobalFoundries? Intel/IBM R&D Partnership
Intel in Talks to Acquire GlobalFoundries Trustworthy sources such as the Wall Street Journal are reporting that Intel is in...
ECTC 2021: Economic Outlook Focuses on the Impact of the Pandemic
For the first time in its 71-year history, the ECTC committee veered away from strictly technical topics to include a...
The Global Packaging Community Shows up for Virtual ECTC!
The pandemic made this a unique year for ECTC. To my knowledge, it is the first time that the in-person...
3D System Integration – It Takes a Village
Actually, 3D System integration takes more than a village. It takes a global effort. As Virtual ECTC 2020 continues this...
ECTC 2020 Online is Accessible at No Charge
When I switched my focus from single-die SoCs to multi-die ICs, I had to learn a lot about IC packaging...
Your Guide to Getting the Most out of Virtual ECTC 2020
One silver lining to COVID 19 for the microelectronics and advanced packaging communities is the ability to attend virtual ECTC...
Stay Virtually Connected with Your Industry Colleagues and Favorite Topics at ECTC 2020
On behalf of the entire Program and Executive Committees, it is my pleasure to invite and welcome all of you...
Fan-out Panel-level Packaging Comes to the ECTC Technology Corner
On my annual trek around the ECTC Technology Corner, I’m always on the look-out for something new to write about....
The ECTC Time Machine: Lead-free Solder, Environmental Reporting, and Next-Generation Sensors
Attending ECTC 2019 this year was like a trip through a time machine. From my post at the 3DInCites booth,...
ECTC 2019 Will Go Back to Basics to Plan for the Future of Microelectronics and Packaging
Whoa! Where did the time go? ECTC 2019 is only three weeks away and I haven’t written my annual preview...
Impressions from ECTC 2017
Let’s start with the indoor rainstorm. I arrived at the Swan and Dolphin in Orlando just in time for the...
Meet Us at ECTC 2017 in Walt Disney World
As each year passes, advanced packaging technologies offer more versatile solutions for cost-effective low-end applications, while 3D integration advancements continue...
Should EDA vendors, OSATS, and their customers cooperate more?
Last week, I attended the packaging-focused 64th Electronic Components and Technology Conference (ECTC) 2014 in Orlando. This week I spent...
ECTC 2014: A Preview of 2.5D and 3D Activities
Each year, the agenda of Electronic Components Technologies Conference (ECTC), an international conference sponsored by the IEEE Components, Packaging, and Manufacturing...News in 3D: the plot thickens at ECTC
Gossip flies at industry events. But usually as soon as someone tells me something juicy, they follow up with “but...
What’s your semi lingo IQ?
I’ve long been fascinated with the vernacular of the semiconductor industry, which is riddled with acronyms that can often mean...