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Let’s catch up on what we missed among our community… Cadence completed the acquisition of the SerDes and memory interface PHY IP business from Rambus. At ISES EU Power in Italy, Dr. Stefan Pieper, Global Application Manager for Semiconductor, spoke about electroless metallization for power semiconductors and introduced MKS’ Atotech’s...
The semiconductor and microelectronics industries are in the midst of a workforce crisis created by, among other things, the combination of explosive growth and a maturing workforce. Competition for STEM talent in other industries has made it difficult to recruit the latest generation of graduates, who are lured by seemingly...
Tokyo Electron (TEL; Head Office: Minato-ku, Tokyo; President: Toshiki Kawai) today announced the launch of Ulucus™ L, a laser edge trimming system for 300ｍｍ wafer-bonded devices. Ulucus L is a laser edge trimming system that integrates an advanced laser control unit with LITHIUS Pro™ Z, TEL’s widely recognized coater/developer platform....
Advanced packaging has continued to evolve with various interconnect technologies on their way towards heterogeneous integration. Different assembly processes are used to optimize the yield of advanced packages, while the development of innovative advanced packaging materials is needed to address the many challenges faced in the assembly process for System...
EVG Academy doubles the amount of training space and technical trainers; provides training on every class of EVG equipment and software EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, today announced that it has established the EVG Academy, a...
I cannot say I enjoyed this year’s COVID 19 version of ECTC 2020, but I guess it was better than nothing. I will leave the discussion of what I would like to see improved in the software package for the organizers. Let’s first take a look at three key papers...
3D InCites presented the 2019 process of the year award to Eric Beyne and Arnita Podpod of IMEC for their flip-chip on fan-out wafer-level package (FC on FOWLP) process that avoids the use of TSVs in active chips to achieve high-density packaging. Advanced packaging practitioners may have noticed the similarities...
Semiconductor Manufacturing International Corporation, one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, has executed a technology transfer and license agreement for Invensas’ Direct Bond Interconnect (DBI®) technology. Through this agreement, SMIC will be able to offer this bonding technology for...
At ECTC 2016, which took place at the Cosmopolitan Las Vegas, Las Vegas, May 31-June 1, 2016, the special session entitled, Memory Technology Advances and Prospects for Packaging may have been one of the “most important starts to ECTC ever.” At least that was TechSearch’s, Jan Vardaman’s impression, and I can’t disagree,...
Micron’s recent announcement that they will be shipping samples of the Hybrid Memory Cube (HMC) and ramping to production in 2014 has brought about another flurry of activity in 3D DRAM discussions. I’ve had more than one person ask me about the differences between HMC and High Bandwidth Memory (HBM)....
