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The outbreak of the COVID-19 pandemic caught most countries and companies off guard and unprepared. Specifically, companies were caught short of personal protection equipment (PPE), along with essential tools, materials, and components to keep manufacturing lines running. Many companies had a business continuity plan (BCP) ready, but all were tested...
It’s December, and a busy three weeks of conferences until most of the semiconductor industry takes a short, two-week respite, or at least slow down, while Christmas, New Year’s, and other holidays are celebrated across the globe. Historically, for me the next two weeks have been one of my favorite...
Connectivity. Electrification. Shared Mobility. Autonomous Driving. McKinsey & Company cites these four disruptive trends behind future mobility — dynamics that could help to transform the quality of life for hundreds of millions of people. McKinsey & Company predicts that by 2030, mobility innovation could dynamically alter everything from safety in...
It’s funny. While COVID 19 has restricted our lives in many ways, in others it’s made things more possible. Take SEMICON Taiwan – an event I have yet to attend in person. Because of COVID, this year there is a hybrid version that makes it possible for all to participate,...
Ira Feldman welcomed about 100 attendees to MEPTEC’s December luncheon at SEMI Headquarters to hear Jan Vardaman, Founder and President of TechSearch International deliver her annual “State of the IC Packaging Industry” address titled, “Market Drivers for Advanced Packaging: 2020 and Beyond.” In her opening statement, Vardaman emphasized that our...
Last June, AMD made 3D integration history with its introduction of the Fiji gaming processor unit (GPU), which for the first time put high bandwidth memory (HBM) — a true 3D stack integrating memory die with through silicon via (TSVs) — into production. Fiji is a Si interposer-based module comprising...
For many years now, the semiconductor industry development has been governed by Moore’s law and the increasing demand for higher performance and lower manufacturing costs. Under this context, the “More than Moore” company, Yole Développement (Yole) has identified a strong interest for panel-level packaging technologies. “At Yole, we saw a...
In July and August schools are closed and many people like to take vacation. Typically nothing major happens during these months. Not this year! It was a lively August, if you consider the recent “adjustments” in the stock markets worldwide as a series of events disrupting the summer doldrums. But...
Phoenix AZ – May 8, 2015 – 3D InCites, the premiere online content source for reliable 3D technology information, today announced Scott Jones, director, Alix Partners, will deliver a keynote address titled How 2.5/3D Technologies Will Shake Up the Semiconductor Supply Chain and Cost Structure at the third annual 3D...
San Jose, CA (May 7, 2015) — SEMI today announced the SEMICON West 2015 technical and business program agenda tackling the most important issues facing the future of semiconductor manufacturing. In addition to the exposition, with over 650 exhibitors planned, SEMICON West will feature over 180 total hours of programs —...
