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November was a dynamic month for the 3D InCites community and the broader semiconductor industry, with companies showcasing innovative technologies, celebrating leadership achievements, expanding global operations, and advancing workforce development. From product launches and AI‑enhanced design platforms to award recognitions and strategic partnerships, industry leaders highlighted breakthroughs in advanced packaging, inspection,...
See equipment demonstrations, including the SELECT Synchro selective soldering system for electronics manufacturing Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate its latest equipment for printed circuit board assembly and advanced packaging at Productronica 2025, joining their longstanding distribution partners Amtest Group, stand A2.532, and...
Latest Generation Front-end Cleaning Tool Reduces Chemical Use by 75% ACM Research, Inc., a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced a major performance breakthrough for its flagship Ultra C Tahoe Cleaning tool. The resulting enhancements are designed to meet demanding technical...
Onto’s JetStep® lithography and Firefly® G3 inspection systems offer a powerful solution as the industry pursues glass core panel transition Wilmington, Mass., July 9, 2024 – Onto Innovation Inc. (NYSE: ONTO) today announced Onto Innovation’s glass substrate suite featuring the JetStep® X500 panel-level packaging lithography system with hybrid substrate handling...
Looking back at the last 10 years, it is very difficult to choose one single event that was the most pivotal for commercializing 3D integration technology. There have been many prior events that have driven 3D integration and aligned the whole industry in migrating from monolithic 2D to heterogeneous and...
Just in case you didn’t have a chance yet to read part 1 of the ISS 2019 blog, covering day 1, it’s posted here. Technology and Manufacturing Trends Day 2 started with a keynote about the magic nanodevices can create, delivered byJo de Boeck, imec’s EVP and chief strategy officer. He emphasized that...
This was my first Electronica, and all I can say is – It is massive. It covered everything to do with the electronics supply chain, from chip design to the chip itself, to the package, component, subassembly, circuit board, through to test and measurement, and enclosures, switches, the works. While...
I’ve long held the belief that when it comes to reading scholarly works, very few people read the entire paper. At best, they read the title, introduction, and conclusion. At most, they skim the rest. Last week at 3D ASIP 2017, my suspicions were confirmed, when it was revealed by...
For the third consecutive January, I spent 3 days in Grenoble attending the European 3D TSV Summit. Each summit has followed a specific theme that aligned with where 3D integration was in its evolution. Kevin Crofton, SPTS, summed it up nicely in his closing remarks this year. In 2013, we...
I attended the 3D IC Technology Forum at SEMICON Taiwan 2014, where many of the discussions focused on the latest memory announcements in 3D ICs from Micron, SK Hynix, Samsung, and Tezzaron. While the world still waits for the introduction of a Wide I/O mobile DRAM and logic part, memory...
