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SEMICON West 2024 Opens July 9 in San Francisco

SEMICON West 2024 to Spotlight Investments in U.S. Semiconductor Manufacturing, AI, Key Trends and Industry Growth Concurrent with SEMICON West, FLEX Conference 2024 to Spotlight Flexible Hybrid Electronics Innovations Investments in the build-out of the U.S. semiconductor manufacturing supply chain will come into sharp focus at SEMICON West 2024 as government and...

February member highlights

February Member Highlights – Acquisitions, Awards, Events, New Offerings and More

The 3D InCites community members continue to create a buzz with announcements from new acquisitions to industry awards, new product introductions, events, job openings, and more. Here’s a collection of February member highlights. Acquisitions, Partnerships and Collaborations ASE announced a strategic partnership with Infineon Technologies, to acquire two back-end manufacturing...

SEMI Honors Semiconductor Industry Sustainability Leaders

MILPITAS, Calif. — December 12, 2023 — SEMI, the global industry association representing the electronics manufacturing and design supply chain, today announced recipients of the 2023 SEMI Sustainability Excellence Award. SEMI President and CEO Ajit Manocha selected the award recipients based on their inspirational leadership and innovative approaches to expanding sustainability practices...

MZ Technologies’ GENIOTM Tool Suite Adopted for Major System-in-Package IC  

An internationally respected System/ASIC company is adopting MZ Technologies’ GENIOTM 1.7 fully-integrated EDA co-design tool. The company adopted a full-suite license and has targeted a next generation global semiconductor product family based on heterogeneous advanced technology system-in-package (SIP.) Details of the design remain scant due to the propriety nature of the...

SEMICON West Smart MedTech Panel: Design Verification in the Supply Chain

All electronic products begin with design be it a single chip, a collection of chips or chiplets such as 3D-IC, or a system based on heterogeneous integration. Ditto for verification, which is now a far more important component of the design flow and one that impacts the entire electronic product...

Understanding Wafer Applications in Surface Metrology

This detailed blog covers how wafers are manufactured and processed, what makes a perfect wafer, and which surface metrology approaches can be used for quality assurance. First… the manufacturing process Microelectronic components and semiconductors are manufactured on round thin discs, referred to as wafers. Wafers can be made of various...

Metrology in Advanced Packaging

With the dawn of chiplet integration, advanced chip manufacturing and advanced packaging technologies are more complex than ever. Dies are being integrated from different wafers, and yield management is tricky. It requires a combination of both electrical test and optical measurement – or metrology. Even more, it requires hybrid metrology...

Figure 2: The DNP glass interposer measures 40 x 40mm.

IFTLE 510: DNP Glass Interposer; Samsung/Amkor team for H-Cube

JISSO JOINT consortium In late 2019 Showa Denko bought Hitachi Chemical (HC) for about $8.9B. HC had an operating income of about $440 million on sales of $6.3B with about 40% of its sales from materials, including chemical mechanical planarization slurries, epoxy compounds, and anode materials for lithium-ion batteries. The...

What Does the Future Look Like for Microelectronics Events?

In a global industry that relies heavily on collaboration, COVID 19 created a big pause and pivot in one of the key business development tools of the microelectronics industry: technology conferences and trade shows. Organizations like IMAPS International and SEMI, which rely on the revenue generated by these events to...