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TechSearch International’s latest report: 2022 Flip Chip and WLP: Trends and Market Forecasts examines the impact of slowing consumer demand on the flip chip and WLP market growth. The report includes an examination of both fan-in WLP and fan-out WLP markets. The report also examines bump pitch trends and the...
Chaired by 3D InCites Community member Steffen Kröhnert of ESPAT Consulting, the Electronics System-Integration Technology Conferences (ESTC) series is a premier venue for academics and industry to present and discuss the latest developments in assembly and interconnection technology and new applications. This year, the event is being held in Sibiu,...
TechSearch International’s latest analysis describes high-performance package options with an update on TSMC’s new offerings, including the latest organics CoWoS® versions. New high-end product examples using fan-out on substrate are discussed. Features of the build-up substrates supporting redistribution layer (RDL) structures are provided. Applications for high-performance wafer-to-wafer hybrid bonding are...
Next week the top global event for Advanced System-in-Package technologies comes to Sedona. Combining the 3D ASIP and IMAPS SiP events into an all-in-one comprehensive program, IMAPS established the Advanced System-in-Package conference to focus exclusively on innovative SiP technology developments, solutions and business trends. Advanced SiP 2022 will be a...
One of the most popular booths at the recent IMAPS DPC was that of wafer-level fan-out technology provider, Deca. Their black tee shirts state “SHIFT HAPPENS” on the front and on the back say, “We clean it up” (referring to their adaptive patterning of course). Also of great interest was...
Reshoring With the ongoing deluge of reshoring activity in the US, it is good to see others pointing out that just manufacturing chips is not what we are after. As IFTLE has steadfastly stated, we need the complete infrastructure moved back onshore and that absolutely includes the new golden child:...
ASE, Inc. CEO, Dr. Tien Wu, has often referred to Sun Tzu’s legendary quote when describing semiconductor market volatility, “In the midst of chaos, there is also opportunity.” This rang particularly true over the past few years. Undoubtedly, the semiconductor chip emerged heroic from the chaos of pandemic times, underscoring...
I think it was Shakespeare who reportedly penned, “Would a rose by any other name still smell as sweet?” or something close to that. Why am I quoting Shakespeare? Well, we have a technology, massively parrallel pick-and-place assembly, that’s been around for more than a decade that I think still...
UMC Becomes #3 Foundry TrendForce reports that UMC is expected to overtake GlobalFoundries as the world’s #3 foundry this quarter (4thQ 2020) reportedly driven by strong demand for display drivers and power management chips. UMC revenue will be US$1.57 billion, with a global market share of 6.9%, compared to GlobalFoundries’...
Scientech to provide local sales, manufacturing and support of YES products in Asia FREMONT, Calif. – Dec 7, 2020YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and AR/VR applications, today announced that it has signed an agreement with its Taiwan-based partner...
