Phoenix AZ – May 8, 2015 – 3D InCites, the premiere online content source for reliable 3D technology information, today announced Scott Jones, director, Alix Partners, will deliver a keynote address titled How 2.5/3D Technologies Will Shake Up the Semiconductor Supply Chain and Cost Structure at the third annual 3D InCites Awards Breakfast. Sponsored by Micron, the event takes place July 16, 2015, at the Impress Lounge above Moscone North during SEMICON West 2015.
Jones is the Director and Semiconductor Practice lead at AlixPartners in San Francisco. He has 15 years of experience in consulting and the semiconductor industry. Prior to his work with AlixPartners, Jones was a senior associate with JP Morgan in their Equity Research group, recognized as the number one research team on Wall Street in the technology sector. He began his career working with Intel Corporation as a finance manager in their Enterprise Products Group, and has consulted with hedge funds and private equity firms on investment portfolio decisions and published extensive research on the technology industry.
Proceeds of the 2015 Awards Program will fund two STEM-based academic scholarships: SEMI Foundation’s SEMI High Tech U Program, which provides secondary school students with an introduction to the high tech industry; and the IEEE Frances B. Hugle Engineering Scholarship, established by TechSearch International Inc.to encourage young women to follow in Hugle’s footsteps and pursue a career in engineering. The charitable donations are largely made possible by the sponsors of this year’s 3D InCites Awards Program, including Silver Sponsor, Mentor Graphics, and Breakfast Sponsor, Micron.
Mentor Graphics is a leader in EDA products for electronics and semiconductor companies with solutions that deliver short design cycle time and high productivity. Mentor’s 3D-IC solution extends across the entire design and implementation flow with tools for custom and digital design, extraction and simulation, thermal analysis, physical sign-off, design for test and yield analysis. Both interposer and TSV-based designs are fully supported today. Components of the solution include the Pyxis™, Olympus-SoC™, Calibre®, Tessent®, and FlowTHERM® products. This is the third year in a row Mentor Graphics has been a Silver Sponsor of the 3D InCites Awards. Mentor won two categories in the 2013 3D InCites Award with its Calibre and Tessent MemoryBIST products.
For the second consecutive year, Micron Technology Inc. is the exclusive Breakfast Sponsor for the 3D InCites Awards. A global leader in advanced semiconductor systems, Micron’s portfolio of high-performance memory technologies-including DRAM, NAND and NOR Flash-is the basis for solid state drives, modules, multi-chip packages and other system solutions. Backed by more than 35 years of technology leadership, Micron’s memory solutions enable the world’s most innovative computing, consumer, enterprise storage, networking, mobile, embedded and automotive applications. In the 3D integration world, Micron is best known for it’s activities in developing the Hybrid Memory Cube and its participation in the Hybrid Memory Cube Consortium. Most recently, the company made headlines with the unveiling of its 3D NAND technology, jointly developed with Intel.
Platinum and Silver Sponsorship opportunities for the 2015 3D InCites Awards are still available for companies who wish to promote their business through this event and support the Frances B. Hugle Engineering Scholarship and SEMI High Tech U. For more information, contact awards@3Dincites.com.
The 3D InCites Awards recognize achievements that further the commercialization of 3D integration technologies. Awards are presented to companies whose innovative products have contributed significantly to the advancement of through silicon via (TSV) technologies and other innovative processes that enable interposer integration, 3D ICs, monolithic 3D ICs, 3D memory, and 3D heterogeneous integration. Nominations are open and will be accepted through June 26, 2015. Program details, nomination criteria, and an online nomination form are found here.
About 3D InCites
3D InCites is the fastest growing online resource devoted exclusively to interposer integration 3D IC, and 3D heterogeneous integration technologies. For 3D integration to happen requires open collaboration across the supply chain. Therefore, 3D InCites strives to inform key decision makers about progress in technology development, design, standards, and infrastructure in order to realize commercial production of interposer integration and 3D IC technologies. For more information visit www.3DinCites.com.
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