Each year, we celebrate your efforts in innovation by hosting the 3D InCites Awards, which recognize excellence in heterogeneous
integration, 3D HI, and chiplet technologies; sustainability; and diversity, equity and inclusion.
Applications for the 2025 Awards open Monday, September 16, 2024, and close Friday, October 18, 2024. Finalists will be published in the 2025
3D InCites Yearbook, and awards will be presented in a ceremony at the IMAPS Device Packaging Conference on Tuesday, March 4, 2025.
This year’s categories include:
- Advanced Technology Enablement (multiple awards)
- Engineer of the Year
- Best Place to Work (Online Vote)
To be considered, applicants must complete an online brief questionnaire and submit it no later than midnight on Friday October 18, 2024.
The 3D InCites Member Advisory Board will review Advanced Technology Awards and Engineer of the Year applications.
The Best Place to Work will be decided via an online vote.
Finalists will be notified in mid-November and required to complete an additional questionnaire by January 6. 2025.
Winners will be notified on Tuesday, February 3, 2025.
All finalists will be acknowledged in the 2025 3D InCites Yearbook.
Awards will be presented in a ceremony on March 4, 2024, during the opening of the IMAPS Device Packaging Conference.
Best Place To Work
As the semiconductor and microelectronics industry is experiencing a talent shortage, 3D InCites is committed to supporting workforce development initiatives. This year, we devote our online vote to one category – the Best Place to Work.
- Nominate your company as the best place to work in the microelectronics industry. The winner is determined based on the votes as a percentage of the company’s total employee base.
- Details coming soon!
Important Dates
- Accepting Applications: September 16-October 18, 2024
- Finalists Notified: November 16, 2024
- Finalists Announced: January 8, 2025
- Awards Presented: March 4, 2025
