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At SEMICON Europa 2023, we heard more good news about 3D heterogeneous Integration from speakers at the CEO Summit and the Advanced Packaging Conference. Not only has it become the champion for the continuation of Moore’s Law scaling, but it also allows us to deliver on power performance area and...
Lam Research announced quantifiable progress has been made toward its environmental, social and governance (ESG) goals with the release of its 2022 ESG report. Lam’s continued progress toward its ESG goals included exceeding its 2025 goals for water savings as well as surpassing its 2025 goal for employee volunteer hours, prompting...
Siemens’ Tessent Multi-die software helps customers dramatically speed and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based on 2.5D and 3D architectures. Global leader in design-for-test (DFT) technology paves the way for mainstream adoption of 3D ICs Innovative solution dramatically streamlines DFT cycles for highly complex multi-die...
Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications, today announced that it has acquired Semiconductor Process Equipment Corporation (SPEC ) of Valencia, California for an undisclosed amount. The companies had announced a strategic partnership agreement in June. The...
3DIC Integration using 3D stacked technologies in its true definition has a long history.1 Richard P. Feynman expressed this vision in 1985: “Another direction of improvement of computing power is to make physical machines three-dimensional.”2 Successively, several research and development (R&D) initiatives started world-wide. In the late 1980s, in a...
We have known for some time that with scaling coming to an end the industry would need to find another way to continue moving forward. One of the options is known as SoC disintegration, which is when a system-on-chip (SoC) is disintegrated into its functional parts and then connect these...
In addition to Francoise’s post about technology megatrends here, below is part one of my perspective, mostly about the SEMICON West keynotes. Design and Manufacturing Are Finally Combining From July 9-11, many IC manufacturing experts came together at SEMICON West in San Francisco’s very nicely renovated Moscone Center. As an industry...
On Monday, April 16, 2018, SEMI, the industry association representing the global electronics manufacturing supply chain, and the Electronic System Design (ESD) Alliance, representing the design community, announced a strategic partnership. On Tuesday I had a very informative conference call with Bettina Weiss, VP Business Development at SEMI and Bob...
A few weeks ago, San Francisco’s Moscone Center hosted the Design Automation Conference (DAC 2015), with many EDA experts and their customers focused on how to design the new wave of 10nm chips, this year and next. Last week the Moscone Center was buzzing again, this time with material suppliers,...
I wish I could be everywhere at once, because there are so many events involving 3D coming up well worth attending. Unfortunately short of cloning myself, which I don’t think the world is ready for, there’s no way for me to cover everything. So instead, I’ve come up with an...
