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Despite capacity increases this year, and additional plans through 2025, demand for FC-BGA substrates is outstripping supply. What’s driving the insatiable demand? Larger substrates are required to support high-performance applications including silicon interposers larger than reticle size and large-area fan-out. The adoption of chiplets requires a complex substrate. With 7,...
SAN FRANCISCO, CA (June 4, 2021) – Under the theme “Devices for a New Era of Electronics: From 2D Materials to 3D Architectures,” the 67th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research...
For the second time in its 71-year history, ECTC will be presented as a virtual conference, opening Tuesday, June 1, 2021, and close on Sunday, July 4, 2021. Keynotes, plenary sessions, and the special panel focus on the year’s most talked-about trends including: The impact of COVID 19 on the...
The IEEE International Solid-State Circuits Conference, – ISSCC 2021 – took place in late February. As we have suspected for some time, these formerly front-end conferences are more and more focusing on packaging and the performance advances you get from new packaging architectures. Let’s first take a look at what...
Substrate capacity remains tight for both flip chip ball grid array (FC-BGA) substrates and laminate-based chip scale packages (CSPs). Substrate suppliers are adding capacity to meet the demand for FC-BGA substrates for server, graphics processor, and networking applications, but demand continues to outstrip supply. Regardless of the package type—whether silicon...
For us at Siemens Digital Industries Software, COVID -19 brought the closure of all our offices and the beginning of learning how to work, collaborate, and do business virtually. The interaction with customers and prospects typically happens on a very personal level, with sales and technical account executives traveling to...
Onto Innovation’s latest inspection advances have resulted in multiple orders from a top 3 OSAT and a top 3 image sensor manufacturer Wilmington, Mass., January 12, 2021 – Onto Innovation Inc. (NYSE: ONTO) today announced the availability of its new Dragonfly® G3 inspection platform designed to meet the most advanced...
The market for high bandwidth memory (HBM) is projected to grow 49% in wafers, including DRAM and logic layers, from 2020 to 2024. Growth is driven by increased adoption in high-performance computing such as AI, networking, graphics, and future server processors. Solutions to package HBM plus logic include silicon interposers...
A lot can happen in a year. And 2020 is certainly no exception. COVID-19 had an enormous impact on our ability to distribute print issues of the Yearbook at industry events. However, we are excited to report that we will move forward with a digital-only version of the 2021 Yearbook,...
Silver Sponsors: Submit your 2021 3D InCites Awards nomination to recognize excellence in heterogeneous integration. 3D InCites Awards nominations are open to all who would like to recognize a technology, individual, or company that has made a significant contribution to the advancement of the heterogeneous roadmap including 3D packaging, interposer...
