A lot can happen in a year. And 2020 is certainly no exception. COVID-19 had an enormous impact on our ability to distribute print issues of the Yearbook at industry events. However, we are excited to report that we will move forward with a digital-only version of the 2021 Yearbook, set for publication by the end of January. And we need YOU to help us fill content!
We have a variety of ways to participate: executive viewpoints, tech features, advertising and more! Submit your ideas asap! Deadlines are fast approaching.
Contribute to our round-up article: How We Navigated COVID-19 and What 2021 Will Bring
Other Executive Viewpoint on this year’s hot topics may include:
- What’s Next for 3D ICs?
- What’s Different about Chiplet Design and Integration?
- Why your OSAT Needs to Be Smarter
- Reliability Testing: More Important than Ever
- An Update on Fan-Out Technology
- Novel Approaches to Wafer Handling
- The SemiSisters of 2020
- How to Hire and Retain an Inclusive Workforce
- Networking Your Way to Success
The Year in Photos
And as all but IMAPS DPC went virtual, capturing our usual collection of photos to remember the year is going to be a challenge. We invite all our community members to contribute photos for consideration from 2020.
Interested in contributing an article? Choose from one of the above topics or pitch us your own idea for:
- Chiplet Architectures
- Heterogeneous Integration
- 3D integration
- Industry Megatrends (5G, AI, edge computing)
There are more ways to advertise with flipping book! The flipbook Yearbook allows for clickable links to urls, emails, social accounts, and even embedded videos! Click here for a sample issue!
Advertisers may submit editorial content for consideration based on the above topics. Articles will also be published throughout 2021 on 3D InCites.
Editorial contributions due:
Nov. 30, 2020
Ad space close:
Dec. 15, 2020
Camera-ready materials due:
Jan. 11, 2021