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Thermal problems in semiconductor electronic systems often go unnoticed and cause failures. Although thermal problems can be understood and avoided by proper design, it takes time and money to build a new system with improved thermal performance. The good news is that there are many thermal analysis tools available that...
Apps natively integrated with the Xcelium Logic Simulator enable users to target domain-specific needs for highest verification performance SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced Xcelium Apps, a portfolio of domain-specific technologies implemented natively on the Cadence® Xcelium™ Logic Simulator kernel that enable automotive, mobile and...
In this paper, we review the three methodologies commonly used to achieve foundry/OSAT requirements for metal-filled areas and planes in advanced package designs: dynamic hatched-filled metal areas, outgassing voids, and dummy metal fill. The key is choosing the methodology that best meets vendor rules, meets your PDN specifications, allows rapid...
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is working with TSMC to accelerate 3D-IC multi-chiplet design innovation. As part of the collaboration, the Cadence® Integrity™ 3D-IC platform, the industry’s first unified platform for 3D-IC planning, implementation and system analysis, is enabled for TSMC 3DFabric™ technologies, TSMC’s comprehensive family of 3D...
Continuing our look at presentations from the IMAPS SiP Conference. Ajinomoto Habib Hichri of Ajinomoto discussed the use of novel dielectric materials for fine RDL in 5G applications. IFTLE has discussed ABF films in previous blogs [ see IFTLE 479 “ABF substrate shortages…”]. High-speed transmission and large body size require...
Dragonfly system growth accelerated by tier 1 customer adoption WILMINGTON, Mass.–(BUSINESS WIRE)– Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation”, “Onto”, or the “Company”) today announced unit volumes of the Company’s Dragonfly inspection system grew 50% in the first half of 2021 compared to the same period in 2020. The remainder...
“Don’t surround yourself with yourself …” Yes, from I’ve Seen All Good People. “At Japan’s Most Elite University, Just 1 in 5 Students Is a Woman.” The New York Times, 08 December 2019 “The semiconductor industry isn’t known as a standout example of diversity and inclusion. But that’s changing.” Jane...
Samsung reports that they have seen increasing interest in multi-die integration (what they call MDI) for markets such as artificial intelligence (AI) and high-performance computing (HPC). They also report a need for new electronic design automation (EDA) solutions because the traditional design doesn’t fully address the latest power and signal...
Last week I attended SEMICO’s Research Summit, in Scottsdale, AZ, and was fortunate to hear some high-level industry executives discuss the emerging landscape of the semiconductor industry, and 3D integration’s role in it. What was most interesting was the resounding call across the board for collaboration across the supply chain,...
Silver Sponsors: Nominations Extended Until Midnight, PDT, February 11, 2022! Submit your 2022 3D InCites Awards nomination to recognize excellence in heterogeneous integration. 3D InCites Awards nominations are open to all who would like to recognize a technology, individual, or company that has made a significant contribution to the advancement...
