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March buzzed with innovation and collaboration in the semiconductor industry, as key players across the globe joined forces to advance technology, foster education, and address sustainability challenges. From groundbreaking product launches to strategic partnerships and workforce development initiatives, here are the highlights of 3D InCites members’ industry news, events, and...
At SEMICON Europa 2023, we heard more good news about 3D heterogeneous Integration from speakers at the CEO Summit and the Advanced Packaging Conference. Not only has it become the champion for the continuation of Moore’s Law scaling, but it also allows us to deliver on power performance area and...
It’s been a busy time on the semiconductor industry front: SEMICON Taiwan; Intel’s Innovation Day; glass interposers making it to center stage; TSMC’s Open Innovation Platform with the announcement of the 3Dblox 2.0; and the first CHIPS Act payout by the Department of Defense (DoD) of $238 million to universities....
The SEMI year ends with Semicon Japan and kicks off with SEMI’s Industry Strategy Symposium. The 2023 ISS was the return to the normal schedule with the 2022 event having been held in April. At the 2022 event, the big news was the semiconductor chip revenues being forecast to top...
Hello, I am Mandy Perdok. I am 20 years old and live in Milsbeek in the Netherlands. My hobbies include playing Netball (Team Sport), training/coaching the Netball youth team, and traveling. As a third-year student majoring in Chemical Engineering at the Fontys Hogeschool Eindhoven of Applied Science, I am completing...
Happy Holidays! Here’s the last of our community news round-up for 2022. Can’t wait to see what’s in store for the New Year. Siemens Digital Industries Software announced that its Sokol™ Flex OS software now supports RISC-V embedded development with the availability of one of the industry’s first commercially supported,...
I have a confession to make. Last March – we’re talking March of 2023 at IMAPS DPC – Beth Keser, IMAPS president, presented me with a signed copy of the book she co-edited with Steffen Khröhnert – Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces:...
ST. FLORIAN, Austria, November 7, 2022—EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has strengthened its portfolio of optical lithography solutions with the unveiling of the next-generation 200-mm version of its EVG®150 automated resist processing...
