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Welcome to our new monthly community member news in review where we will highlight community news, events, milestones, anything worth sharing from the month previous. If we missed you this month, be sure to add us to your distribution list, we don’t want to leave anyone out. Our community members...
IR laser cleave technology enables nanometer-precision layer transfer through silicon, eliminating glass substrates for advanced packaging and enabling thin-layer 3D stacking EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced NanoCleave™, a revolutionary layer release technology for silicon...
I’ve started so many event blog posts since the return of live events with the phrase – it’s good to be back! But it bears repeating. And with ECTC 2022 weighing in with record attendance at about 2000 attendees, it’s clear that we are all pretty much done with virtual...
Tech company recognizes Asia presence is crucial to continuous growth Taipei, Taiwan–November 28, 2021– Brewer Science, a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, commemorates the 20th Anniversary of establishing its first Asia location, now one of five Brewer Science offices...
October is a busy month as conferences go. ARM and Intel each held their virtual developer events focusing on the future of compute. IMAPS addressed packaging technology, and TSMC held its Open Innovation Platform (OIP) forum, also in late October. AMD followed up with an accelerated data center event in...
EVG®40 NT2 offers breakthrough metrology performance to accelerate implementation of wafer- and die-level hybrid bonding and maskless lithography FLORIAN, Austria, November 15, 2021—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the EVG®40 NT2 automated metrology system, which...
While I am very dedicated to my role as a blogger for the semiconductor industry, there is one thing to which I am more dedicated: A good night’s sleep. So for the Live days of ISS Europe 2021, I only attended the panel discussions that were scheduled at 7 am...
Heterogeneous integration (HI) is fast becoming a key driver of semiconductor development due to its ability to scale the number of individual chips onto a miniaturized system-in-package that enhances functionality, achieves higher efficiency, and even reduces power consumption. At the recently concluded SEMICON CHINA 2021 Advanced Packaging Forum, Dr KK...
ERS electronic, the innovation leader in thermal management solutions for the semiconductor manufacturing industry, is appointing Joshua Zhou as Vice President. Zhou joined the company as Sales and Marketing Director in 2018 when ERS opened its China sales office in Shanghai. Joshua has more than twenty years of experience in...
While most of SEMI’s global events went virtual in 2020, SEMICON Europa was straight-up canceled. While I was disappointed, since it’s my favorite SEMI event, I was also glad to not miss out, as COVID-19 prevented international travel. I was also relieved that it didn’t go virtual, since at the...
