They call me the “Queen of 3D” because I have been following the course of 3D integration and blogging about it since 2009. Francoisein3D is the featured blog on this site.
Georgia Tech’s Packaging Research Center, in its pioneering chip-last embedded interconnection technology, demonstrates World's Thinnest 3D Organic Package at 130um thickness...
Amkor Technology, Inc. provider of semiconductor packaging and test services, has granted SHINKO Electric Industries Co, Ltd. a non-exclusive license...
Repeat Order for IQ Aligner Further Solidifies EVG’s Position as Leading Microlens Molding Solutions Provider for Wafer-level Camera Applications St....
