The 3D-IC LinkedIn Group announced today that it has reached more than 1,100 members. The discussion forum for 3D Integrated Circuits (3D-ICs) was established in July of 2011. The increasing level of interest shown by the industry in the past few months makes this LinkedIn Group a good opportunity for industry professionals to update themselves with the latest trends in the field. The group has experienced rapid membership growth over the past 10 months, making it the largest forum for 3D technology on LinkedIn.
The most notable impact in the group’s discussions comes from the presence of key engineers, researchers, and decision makers in the 3D chip space. This makes the group a good place for knowledgeable and influential discussions. At this time, the 3D-IC LinkedIn Group’s membership includes 355 executives, 170 managers, 156 VPs, 152 directors and 112 engineers. It is run by a team of volunteers working on 3D-ICs, with support from MonolithIC 3D Inc. It is intended to help industry professionals share information about the technology and build awareness for the various 3D-IC alternatives as they continuously evolve.
The global 3D IC market is expected to grow from $2.21 billion in 2009 to $6.55 billion in 2016 at a CAGR of 16.9% from 2011 to 2016. The companies in this market need to efficiently balance their expenditure between capacity expansion and technology advancement. This is considered critical since the market for 3D ICs has yet to gain complete recognition and its successful penetration into different end-user segments is largely governed by the R&D initiatives.
The 3D-IC LinkedIn Group has a good partnership with 3D-ICs.com, a website dedicated to bring the latest news stories on the technology, and 3D InCites, an online community created to enhance interest in both 3D packaging and 3D IC technologies. Top news articles and blog posts from both sites are shared on the 3D-IC LinkedIn Group for discussion and comment.
”The 3D-IC LinkedIn Group is a unique gathering spot for all 3D IC enthusiasts, including process engineers, chip and package designers, as well as the EDA and test communities. The industry has called for collaboration across the supply chain, and this group provides a forum all the various players to mingle and share information. It seems members are more willing to post their opinions here than on the different news sites because of its neutral affiliation,” said Francoise von Trapp, editorial director of 3D InCites and 3D ICs.com “That is what makes it such a great resource. If you haven’t already became a member, I urge you to join the 3D IC LinkedIn Group.”
You can join the 3D- IC LinkedIn Group by clicking here.