Latest Posts
Move Over 3D Memory, Logic-on-Logic Stacks Have Arrived!
Chalk up another industry first for Tezzaron Semiconductor, who announced just today (or tomorrow, if you are there for the excitement at IEEE...
Tessera to Acquire Ziptronix, Inc. for $39 Million
SAN JOSE, CA (August 28) — Tessera Technologies, Inc. announced the acquisition of Ziptronix, Inc. for $39 million in cash....
The Future of Image Sensors is Chip Stacking
CMOS image sensors (CIS) have often been heralded as the first 3D devices in volume manufacturing. However, this is not really...
Market Outlook for Permanent Wafer Bonding
Permanent wafer bonding can be categorized based on bonding with or without an intermediate layer. Intermediate layers can be subcategorized...
Tezzaron, Ziptronix, and Invensas Demonstrate Interconnectology in Action
It may have been a coincidence that at last week’s 3D ASIP Conference, Invensas, Tezzaron/Novati, and Ziptronix booths were lined...
The Many Flavors of 3D DRAM
Micron’s recent announcement that they will be shipping samples of the Hybrid Memory Cube (HMC) and ramping to production in...
EV Group: Never a Dull Moment
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. Sitting down with...
Ziptronix: Copper DBI Technology for 3D Memory Assemblies
Product Description Copper DBI® technology is a patented low cost, scalable process technology that was licensed for 3D memory assemblies...
2013 Predictions for 3D ICs as reported by SPN
While most of the semiconductor trade publications wrapped up their 2013 prediction posts by mid January, Semiconductor Packaging News (SPN) forged...
Breaking News from SEMICON West
There's no place like SEMICON West for a company to make a major announcement. After all, it is the semiconductor...Ziptronix Takes on 3D Memory
After seeing the latest press release on Ziptronix foray into the memory space, I sought out Kathy Cook, business development...Ziptronix Goes Commercial
Ever since I got involved in the world of advanced packaging, and particularly 3D, I’ve had a soft spot for...Ziptronix CTO to Speak at RTI Meeting on 3-D Architectures For Semiconductor Integration and Packaging, Dec. 14
Paul Enquist, Ziptronix Inc.’s chief technology officer and vice president of R&D, will provide an update on direct bond technology...