Latest Posts
Launching a Trillion Sensors on a Sea of Through Silicon Vias
To the readers of 3D InCites: Happy New Year! I hope your 2014 will be a healthy and prosperous one...
Shaping the Future of MEMS, Sensors, and 3D IC: Fertile Grounds for Collaboration
STMicroelectronics brought a “Who’s Who” of thought leaders from across the MEMS and Sensors ecosystem to Santa Clara, CA, on...
Managing 3D IC Supply Chain Complexity and Cost: A Conversation with WWK – Part 2
“The time has come when we have to understand that we can only compete WHEN we collaborate.” (Sudipto Roy, SMIC,... SPTS Ships 1000th DRIE Process Module
Milestone shipment extends company’s leadership in DRIE Newport, United Kingdom, and SEMICON Singapore, 7 May, 2013 – SPTS Technologies, a supplier...
Temporary Bond/Debond: Not Ready for 3D TSV Prime TIme
It’s too bad SUSS MicroTec’s Wilfried Bair was one of the last presenters on Friday at 3D Architecures for Systems...
Fraunhofer IZM Update with M. Juergen Wolf
I’ve been on a mission to interview the directors of all three European microelectronics research centers that are participating in...
ACM Research: New Kid on the 3D Block
Yesterday at the pre-conference symposium for 3D Architectures for Semiconductor Integration and Packaging (3D ASIP), I was fortunate to get an...Oerlikon streamlines for 3D and solar
Oerlikon’s double-barrel news about the sale of its Oerlikon Esec business unit to BESI, and expected management buyout of...What’s holding up TSV adoption now?
One of the questions plaguing all of us waiting for the adoption of TSVs for 3D IC stacking is what's...
