process control

Supporting the 3D Megatrend in Semiconductor Manufacturing

Supporting the 3D Megatrend in Semiconductor Manufacturing

We’ve waited a long time for this, and now it’s here. There is a 3D megatrend happening in semiconductor manufacturing, as scaling alone does not meet the sophisticated computing needs of Industry 4.0 applications like blockchain, 5G, the internet of things (IoT), autonomous transportation, telemedicine, and more. These emerging technologies call for more advanced technologies like artificial ... »

Reliable Process Control Solutions for the Growing Power Device Market

Reliable Process Control Solutions for the Growing Power Device Market

The expected increase of the power device market, with a compound annual growth rate (CAGR) of more than 10% — and more particularly insulated-gate bipolar transistor (IGBT) products for automotive and other applications — is pushing the semiconductor industry to adopt specific process solutions. The maturity of IGBT market, boosted by booming demand for electrified vehicles (EV) and hybrid el... »

UnitySC Unveils New Inspection System for the Advanced Packaging and Wafer Processing Ecosystem

UnitySC Unveils New Inspection System for the Advanced Packaging and Wafer Processing Ecosystem

Grenoble, France (November 8, 2018)— UnitySC European leader and a key player in inspection and metrology solutions, today launched the Unity_LIGHTiX ™ system for micro/macro all surface inspection and 2D/3D metrology. This new inspection and metrology system has been designed to address multiple applications including redistribution layers (RDL) down to 2/2 µm line/space, as well as µbump i... »

Diversification of Markets Calls for Hybrid Metrology with Multi-Sensor Technology

Diversification of Markets Calls for Hybrid Metrology with Multi-Sensor Technology

It used to be that people thought about metrology for front-end process control and inspection for advanced packaging. As wafer level packaging (WLP) and heterogeneous integration (HI) approaches became more advanced, metrology processes began creeping into back-end process control, where measurement becomes trickier and more diversified. As part of the 3D InCites Award Winners series, I spoke wit... »

Volumes Matter and Other Conversations from SEMICON West 2018

Volumes Matter and Other Conversations from SEMICON West 2018

The world wants intelligence in everything, especially things that aren’t nailed down like autonomous cars, and the internet of things (IoT) devices. And suddenly, semiconductors are the hottest game in town. Here’s how some of these trends are impacting suppliers that I spoke with at SEMICON West. The importance of purity While Entegris is agnostic to megatrends, Jim O’Neill, CTO, still... »

UnitySC Opens New Asia Entity to Support Advanced Packaging and Power Device Markets

UnitySC Opens New Asia Entity to Support Advanced Packaging and Power Device Markets

Hsinchu, Taiwan – May 8, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced the opening of its Asia subsidiary, Unity Semiconductor Limited Company (UnitySC Asia). The entity was established to deliver enhanced customer support for UnitySC’s growing installed base of inspection and metrology tools throughout the region. UnitySC Asia is headquartered at T... »

UnitySC Acquires HSEB Dresden GmbH to Become a Global Leader in Semiconductor Process Control

UnitySC Acquires HSEB Dresden GmbH to Become a Global Leader in Semiconductor Process Control

Grenoble, France – March 20, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced it acquired 100% of the shares of HSEB Dresden, GmbH (HSEB), a leading supplier in optical inspection, review, and metrology for high-value semiconductor applications. Following the acquisition, the new entity’s extended line of leading-edge semiconductor process control solu... »

UnitySC Opens Global Software Development Center and Customer Demo Lab in the U.S.

UnitySC Opens Global Software Development Center and Customer Demo Lab in the U.S.

Austin, Texas – Oct. 23, 2017 – UnitySC today announced at the International Wafer Level Packaging Conference (IWLPC) in San Jose, Calif., the opening of Unity Semiconductor Inc., the company’s new global software development center and North America customer demonstration lab located in Austin, Texas. The new facility serves as the company’s main center for software development and will h... »

Rudolph Technologies Launches New Truebump Technology at SEMICON Taiwan 2017

Rudolph Technologies Launches New Truebump Technology at SEMICON Taiwan 2017

Wilmington, Mass. (September 11, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announces new Truebump™ Technology on the Dragonfly™ Inspection System. Truebump Technology provides fast, accurate and repeatable three-dimensional (3D) metrology for all advanced packaging bumping applications, from copper (Cu) pillar, to micro-bumps, and even large C4 bumps. With the Dragonfly system, the advan... »

UnitySC Pushes The Boundaries of Measurement with New Nanotopography Metrology Platform

UnitySC Pushes The Boundaries of Measurement with New Nanotopography Metrology Platform

Grenoble, France, March 14, 2017 – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today introduced its new NST Series at SEMICON China in Shanghai. The NST Series is the world’s first non-contact metrology solution for accurately measuring the nanoscale surface topography of semiconductor wafe... »

Page 1 of 212