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IMAPS DPC 2024 Community Member Preview
IMAPS 20th Annual Device Packaging Conference – Event Highlights The International Microelectronics Assembly and Packaging Society (IMAPS) 20th annual Device...
Mosaic Microsystems Awarded $1 Million from Defense Business Accelerator Microelectronics Challenge
Mosaic Microsystems LLC proudly announces its success in winning a $1.0 million award as one of the competitors in the...
Member Monthly Highlights – November
IMAPS held its Arizona Chapter Event at Deca Technologies, which included a presentation from Clifford Sandstrom on: “Achieving High-Density Die-to-Die Integration with...
Mosaic Microsystems Adds Brittany Hedrick as Senior Engineering Manager
November 7, 2023–Mosaic Microsystems proudly announces the addition of Brittany Hedrick as Senior Engineering Manager. Brittany brings a wealth of experience in...
Community Member Conversations from IMAPS 2023
At the 2023 IMAPS Symposium in October, I had some great community member conversations about some of the hot topics...
DoD Awards Contract to Mosaic Microsystems to Work with AIM Photonics on Cutting-edge Glass-based Electronic and Photonic Interposers
Mosaic Microsystems, a pioneering leader in advanced microelectronics glass packaging technology, is delighted to announce the successful award of a...
IMAPS San Diego Community Member Preview
The 56th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) is just around the corner. This...
CHIPcon Community Member Preview
The top global event for Chiplet and Heterogeneous Integration Packaging (CHIP), covering advanced technology developments and solutions, device integration strategies,...
IMAPS DPC Community Member Preview
The 19th Annual Device Packaging Conference (DPC 2023) is scheduled for next week, March 13-16, 2023, at the WeKoPa Conference...
The US CHIPS Act: A Small Business Perspective
As a small U.S. semiconductor packaging company, Mosaic Microsystems is very supportive of the CHIPS Act and looks forward to...
Community Member Preview: Chiplet Summit
Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968,...
Chris Mann Joins Mosaic Microsystems as Vice President of Business Development
November 9, 2022 — Mosaic Microsystems, a microelectronics and photonics packaging company providing thin glass substrates and through-glass vias (TGVs)...
The Power of Community at the IMAPS International Symposium
One of the things I love most about being part of the International Microelectronics and Packaging Society (IMAPS) is the...
Community Member Monthly Highlights – September
Welcome to our new monthly community member news in review where we will highlight community news, events, milestones, anything worth...
3DInCites Community Members Well Represented at IMAPS Boston — Here’s a Preview
The 55th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week in Boston with...
What’s Happening at the IMAPS SiP Conference?
Next week the top global event for Advanced System-in-Package technologies comes to Sedona. Combining the 3D ASIP and IMAPS SiP...
2022 IMAPS DPC: Back and Better Than Ever
After two years of virtual conferences, it was great to be back in person last week at the 2022 IMAPS...
Congratulations to the Winners of the 2022 3D InCites Awards!
It is my honor to announce the winners of the 2022 3D InCites Awards. With 51 nominees in 11 categories,...
